- Applied Filters :
19 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package | Voltage - Supply | Memory Type | Memory Size | Access Time | Memory Format | Write Cycle Time - Word, Page | Memory Interface | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||
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VIEW |
2,684
In-stock
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Microchip Technology | IC EEPROM 256KBIT 90NS 28FLATPK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 90ns | EEPROM | 3ms | Parallel | |||
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VIEW |
3,180
In-stock
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Microchip Technology | IC EEPROM 256KBIT 90NS 28FLATPK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 90ns | EEPROM | 10ms | Parallel | |||
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VIEW |
2,781
In-stock
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Microchip Technology | IC EEPROM 256KBIT 120NS 28FLATPK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 120ns | EEPROM | 3ms | Parallel | |||
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VIEW |
3,050
In-stock
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Microchip Technology | IC EEPROM 256KBIT 120NS 28FLATPK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 120ns | EEPROM | 10ms | Parallel | |||
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VIEW |
1,591
In-stock
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Microchip Technology | IC EEPROM 256KBIT 90NS 28FLATPK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 90ns | EEPROM | 10ms | Parallel | |||
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VIEW |
2,101
In-stock
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Microchip Technology | IC EEPROM 256KBIT 90NS 28FLATPK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 90ns | EEPROM | 10ms | Parallel | |||
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VIEW |
3,171
In-stock
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Microchip Technology | IC EEPROM 256KBIT 150NS 28FLATPK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 150ns | EEPROM | 10ms | Parallel | |||
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VIEW |
2,133
In-stock
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Microchip Technology | IC EEPROM 256KBIT 120NS 28FLATPK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 120ns | EEPROM | 10ms | Parallel | |||
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VIEW |
3,805
In-stock
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Microchip Technology | IC EEPROM 256KBIT 150NS 28FLATPK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 150ns | EEPROM | 3ms | Parallel | |||
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VIEW |
2,416
In-stock
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Microchip Technology | IC EEPROM 256KBIT 200NS 28FLATPK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 200ns | EEPROM | 10ms | Parallel | |||
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VIEW |
1,437
In-stock
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Microchip Technology | IC EEPROM 256KBIT 150NS 28FLATPK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 150ns | EEPROM | 10ms | Parallel | |||
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VIEW |
2,770
In-stock
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Microchip Technology | IC EEPROM 256KBIT 250NS 28FLATPK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 250ns | EEPROM | 10ms | Parallel | |||
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VIEW |
1,333
In-stock
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Microchip Technology | IC EEPROM 256KBIT 250NS 28FLATPK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 250ns | EEPROM | 10ms | Parallel | |||
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VIEW |
930
In-stock
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Microchip Technology | IC EEPROM 256KBIT 150NS 28FLATPK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 150ns | EEPROM | 10ms | Parallel | |||
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VIEW |
3,566
In-stock
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Microchip Technology | IC EEPROM 256KBIT 250NS 28FLATPK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 250ns | EEPROM | 10ms | Parallel | |||
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VIEW |
814
In-stock
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Microchip Technology | IC EEPROM 256KBIT 250NS 28FLATPK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 250ns | EEPROM | 10ms | Parallel | |||
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VIEW |
998
In-stock
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Microchip Technology | IC EEPROM 256KBIT 150NS 28FLATPK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 150ns | EEPROM | 10ms | Parallel | |||
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VIEW |
3,121
In-stock
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Microchip Technology | IC EEPROM 256KBIT 200NS 28FLATPK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 200ns | EEPROM | 10ms | Parallel | |||
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VIEW |
1,746
In-stock
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Microchip Technology | IC EEPROM 256KBIT 200NS 28FLATPK | - | Active | Tube | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed | 4.5 V ~ 5.5 V | Non-Volatile | 256Kb (32K x 8) | 200ns | EEPROM | 10ms | Parallel | |||
