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| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Package / Case | Interface | Supplier Device Package | Number of Circuits | Voltage - Supply | Function | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||
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VIEW |
819
In-stock
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Maxim Integrated | IC TDM/PACKET TRANSPORT 676BGA | - | Discontinued at Digi-Key | Tray | -40°C ~ 85°C | Surface Mount | 676-BGA | TDMoP | 676-TEPBGA (27x27) | 1 | 1.8V, 3.3V | TDM-over-Packet (TDMoP) | |||
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|
VIEW |
3,407
In-stock
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Maxim Integrated | IC TDM PACKET 32PORT 676PBGA | - | Not For New Designs | Tray | -40°C ~ 85°C | Surface Mount | 676-BGA | TDMoP | 676-TEPBGA (27x27) | 1 | 1.8V, 3.3V | TDM-over-Packet (TDMoP) | |||
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|
VIEW |
1,334
In-stock
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Maxim Integrated | IC TDM OVER PACKET 676-BGA | - | Active | Tray | -40°C ~ 85°C | Surface Mount | 676-BGA | TDMoP | 676-TEPBGA (27x27) | 1 | 1.8V, 3.3V | TDM-over-Packet (TDMoP) | |||
