Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Applications Package / Case Interface Supplier Device Package Voltage - Supply Core Processor Number of I/O RAM Size Program Memory Type Controller Series
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
1,690
In-stock
NXP USA Inc. MCU SECURE ID - Active - -40°C ~ 90°C - Authentication - I²C, 2-Wire Serial - 1.62 V ~ 5.5 V MX51 - 3.2kB EEPROM (76.4 kB) A700x
Default Photo
RFQ
VIEW
RFQ
3,247
In-stock
NXP USA Inc. MCU SECURE ID - Active - -25°C ~ 85°C - Authentication - I²C, 2-Wire Serial - 1.62 V ~ 5.5 V MX51 - 3.2kB EEPROM (76.4 kB) A700x
A7101CHTK2/T0BC2VJ
RFQ
VIEW
RFQ
2,903
In-stock
NXP USA Inc. AU10TICS - Active Digi-Reel® -25°C ~ 90°C (TA) Surface Mount Authentication 8-VDFN Exposed Pad I²C 8-HVSON (4x4) 2.5 V ~ 3.6 V MX51 - - - -
A7101CHTK2/T0BC2VJ
RFQ
VIEW
RFQ
3,573
In-stock
NXP USA Inc. AU10TICS - Active Cut Tape (CT) -25°C ~ 90°C (TA) Surface Mount Authentication 8-VDFN Exposed Pad I²C 8-HVSON (4x4) 2.5 V ~ 3.6 V MX51 - - - -
A7101CHTK2/T0BC2VJ
RFQ
VIEW
RFQ
2,560
In-stock
NXP USA Inc. AU10TICS - Active Tape & Reel (TR) -25°C ~ 90°C (TA) Surface Mount Authentication 8-VDFN Exposed Pad I²C 8-HVSON (4x4) 2.5 V ~ 3.6 V MX51 - - - -
MAXQ1004-B01+
RFQ
VIEW
RFQ
2,736
In-stock
Maxim Integrated MAXQ1004 AUTH MICRO 16 TQFN LF - Obsolete Tube -40°C ~ 85°C Surface Mount Authentication 16-WQFN Exposed Pad 1-Wire®, SPI 16-TQFN (4x4) 1.7 V ~ 3.6 V MAXQ20 8 640 x 8 FLASH (16 kB), ROM (4 kB) MAXQ™
A7001AGHN1/T1AG315
RFQ
VIEW
RFQ
652
In-stock
NXP USA Inc. MCU SECURE ID 32-HVQFN - Obsolete Tray -25°C ~ 85°C Surface Mount Authentication 32-VFQFN Exposed Pad I²C, 2-Wire Serial 32-HVQFN (5x5) 1.62 V ~ 5.5 V MX51 - 3.2kB EEPROM (76.4 kB) A700x