Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Package / Case Supplier Device Package Peripherals Core Processor Speed Voltage - Supply (Vcc/Vdd) Number of I/O RAM Size Core Size Connectivity Program Memory Type Data Converters Oscillator Type
GLOBAL STOCKS
MCF5253VM140J
RFQ
VIEW
RFQ
2,136
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 225MAPBGA MCF525x Obsolete Tray -20°C ~ 70°C (TA) 225-LFBGA 225-MAPBGA (13x13) DMA, WDT Coldfire V2 140MHz 1.08 V ~ 1.32 V - 128K x 8 32-Bit CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG ROMless A/D 6x12b External
MCF5253CVM140J
RFQ
VIEW
RFQ
1,176
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 225MAPBGA MCF525x Obsolete Tray -40°C ~ 85°C (TA) 225-LFBGA 225-MAPBGA (13x13) DMA, WDT Coldfire V2 140MHz 1.08 V ~ 1.32 V - 128K x 8 32-Bit CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG ROMless A/D 6x12b External
MCF5253CVM140
RFQ
VIEW
RFQ
3,833
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 225MAPBGA MCF525x Not For New Designs Tray -40°C ~ 85°C (TA) 225-LFBGA 225-MAPBGA (13x13) DMA, WDT Coldfire V2 140MHz 1.08 V ~ 1.32 V - 128K x 8 32-Bit CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG ROMless A/D 6x12b External
MCF5253VM140
RFQ
VIEW
RFQ
1,376
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 225MAPBGA MCF525x Not For New Designs Tray -20°C ~ 70°C (TA) 225-LFBGA 225-MAPBGA (13x13) DMA, WDT Coldfire V2 140MHz 1.08 V ~ 1.32 V - 128K x 8 32-Bit CAN, EBI/EMI, I²C, QSPI, UART/USART, USB OTG ROMless A/D 6x12b External