Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Package / Case Supplier Device Package Peripherals Core Processor Speed Voltage - Supply (Vcc/Vdd) Number of I/O RAM Size Core Size Connectivity Program Memory Size Program Memory Type Data Converters Oscillator Type
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LPC3141FET180,551
RFQ
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RFQ
1,180
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 180TFBGA LPC3100 Obsolete Tray -40°C ~ 85°C (TA) 180-TFBGA 180-TFBGA (12x12) DMA, I²S, LCD, PWM, WDT ARM926EJ-S 270MHz 1.1 V ~ 3.6 V 20 192K x 8 16/32-Bit EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG - ROMless A/D 4x10b External
LPC3154FET208,551
RFQ
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RFQ
2,343
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 208TFBGA LPC3100 Obsolete Tray -40°C ~ 85°C (TA) 208-TFBGA 208-TFBGA (12x12) DMA, I²S, LCD, PWM, WDT ARM9® 180MHz 1.1 V ~ 3.6 V 10 192K x 8 16/32-Bit EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG - ROMless A/D 3x10b External
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RFQ
VIEW
RFQ
1,614
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 208TFBGA LPC3100 Obsolete Tray -40°C ~ 85°C (TA) 208-TFBGA 208-TFBGA (12x12) DMA, I²S, LCD, PWM, WDT ARM9® 180MHz 1.1 V ~ 3.6 V 10 192K x 8 16/32-Bit EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG - ROMless A/D 3x10b External
LPC3143FET180,551
RFQ
VIEW
RFQ
751
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 180TFBGA LPC3100 Active Tray -40°C ~ 85°C (TA) 180-TFBGA 180-TFBGA (12x12) DMA, I²S, LCD, PWM, WDT ARM926EJ-S 270MHz 1.1 V ~ 3.6 V 20 192K x 8 16/32-Bit EBI/EMI, I²C, IrDA, Memory Card, PCM, SPI, UART/USART, USB OTG - ROMless A/D 4x10b External