Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Package / Case Supplier Device Package Peripherals Core Processor Speed Voltage - Supply (Vcc/Vdd) Number of I/O RAM Size Core Size Connectivity Program Memory Size Program Memory Type Data Converters Oscillator Type
GLOBAL STOCKS
LPC18S10FET180E
RFQ
VIEW
RFQ
3,788
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 180TFBGA LPC18xx Active Tray -40°C ~ 85°C (TA) 180-TFBGA 180-TFBGA (12x12) Brown-out Detect/Reset, DMA, I²S, POR, WDT ARM® Cortex®-M3 180MHz 2.2 V ~ 3.6 V 49 136K x 8 32-Bit CAN, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART - ROMless A/D 4x10b; D/A 1x10b Internal
LPC18S10FET100E
RFQ
VIEW
RFQ
2,323
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 100TFBGA LPC18xx Active Tray -40°C ~ 85°C (TA) 100-TFBGA 100-TFBGA (9x9) Brown-out Detect/Reset, DMA, I²S, POR, WDT ARM® Cortex®-M3 180MHz 2.2 V ~ 3.6 V 49 136K x 8 32-Bit CAN, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART - ROMless A/D 4x10b; D/A 1x10b Internal
LPC18S10FBD144E
RFQ
VIEW
RFQ
1,396
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 144LQFP LPC18xx Active Tray -40°C ~ 85°C (TA) 144-LQFP 144-LQFP (20x20) Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT ARM® Cortex®-M3 180MHz 2.2 V ~ 3.6 V 83 136K x 8 32-Bit CAN, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART - ROMless A/D 8x10b; D/A 1x10b Internal