Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Package / Case Supplier Device Package Peripherals Core Processor Speed Voltage - Supply (Vcc/Vdd) Number of I/O RAM Size Core Size Connectivity Program Memory Size Program Memory Type Data Converters Oscillator Type
GLOBAL STOCKS
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RFQ
3,950
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NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 3MB MAC57Dxxx Active Tray -40°C ~ 105°C (TA) 516-BGA 516-MAPBGA (27x27) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 3MB (3M x 8) Flash A/D 24x12b Internal
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RFQ
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RFQ
3,408
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 3MB MAC57Dxxx Active Tray -40°C ~ 105°C (TA) 516-BGA 516-MAPBGA (27x27) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 3MB (3M x 8) Flash A/D 24x12b Internal
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RFQ
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RFQ
3,866
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 4MB MAC57Dxxx Active Tape & Reel (TR) -40°C ~ 105°C (TA) 516-BGA 516-MAPBGA (27x27) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 4MB (4M x 8) Flash A/D 24x12b Internal
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RFQ
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RFQ
1,043
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 4MB MAC57Dxxx Active Tape & Reel (TR) -40°C ~ 105°C (TA) 516-BGA 516-MAPBGA (27x27) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 4MB (4M x 8) Flash A/D 24x12b Internal
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RFQ
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RFQ
2,139
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 3MB MAC57Dxxx Active Tape & Reel (TR) -40°C ~ 105°C (TA) 208-LQFP Exposed Pad 208-LQFP (28x28) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 3MB (3M x 8) Flash A/D 24x12b Internal
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RFQ
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RFQ
865
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 3MB MAC57Dxxx Active Tape & Reel (TR) -40°C ~ 105°C (TA) 208-LQFP Exposed Pad 208-LQFP (28x28) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 3MB (3M x 8) Flash A/D 24x12b Internal
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RFQ
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RFQ
3,620
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 3MB MAC57Dxxx Active Tray -40°C ~ 105°C (TA) 208-LQFP Exposed Pad 208-LQFP (28x28) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 3MB (3M x 8) Flash A/D 24x12b Internal
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RFQ
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RFQ
916
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 3MB MAC57Dxxx Active Tray -40°C ~ 105°C (TA) 208-LQFP Exposed Pad 208-LQFP (28x28) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 3MB (3M x 8) Flash A/D 24x12b Internal
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RFQ
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RFQ
3,418
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 3MB MAC57Dxxx Active Tape & Reel (TR) -40°C ~ 105°C (TA) 516-BGA 516-MAPBGA (27x27) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 3MB (3M x 8) Flash A/D 24x12b Internal
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RFQ
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RFQ
3,588
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 3MB MAC57Dxxx Active Tape & Reel (TR) -40°C ~ 105°C (TA) 516-BGA 516-MAPBGA (27x27) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 3MB (3M x 8) Flash A/D 24x12b Internal
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RFQ
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RFQ
1,030
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 2MB MAC57Dxxx Active Tape & Reel (TR) -40°C ~ 105°C (TA) 208-LQFP Exposed Pad 208-LQFP (28x28) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 2MB (2M x 8) Flash A/D 24x12b Internal
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RFQ
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RFQ
1,499
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 2MB MAC57Dxxx Active Tape & Reel (TR) -40°C ~ 105°C (TA) 208-LQFP Exposed Pad 208-LQFP (28x28) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 2MB (2M x 8) Flash A/D 24x12b Internal
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RFQ
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RFQ
961
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 2MB MAC57Dxxx Active Tray -40°C ~ 105°C (TA) 208-LQFP Exposed Pad 208-LQFP (28x28) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 2MB (2M x 8) Flash A/D 24x12b Internal
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RFQ
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RFQ
2,982
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 2MB MAC57Dxxx Active Tray -40°C ~ 105°C (TA) 208-LQFP Exposed Pad 208-LQFP (28x28) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 2MB (2M x 8) Flash A/D 24x12b Internal
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RFQ
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RFQ
2,476
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 4MB MAC57Dxxx Active Tray -40°C ~ 105°C (TA) 516-BGA 516-MAPBGA (27x27) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 4MB (4M x 8) Flash A/D 24x12b Internal
SAC57D54HCVMO
RFQ
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RFQ
3,808
In-stock
NXP USA Inc. IC MCU 32BIT 4MB FLASH 516MAPBGA MAC57Dxxx Active Tray -40°C ~ 105°C (TA) 516-BGA 516-MAPBGA (27x27) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 4MB (4M x 8) Flash A/D 24x12b Internal
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RFQ
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RFQ
2,283
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 4MB MAC57Dxxx Active Tape & Reel (TR) -40°C ~ 105°C (TA) 208-LQFP Exposed Pad 208-LQFP (28x28) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 4MB (4M x 8) Flash A/D 24x12b Internal
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RFQ
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RFQ
3,439
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 4MB MAC57Dxxx Active Tape & Reel (TR) -40°C ~ 105°C (TA) 208-LQFP Exposed Pad 208-LQFP (28x28) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 4MB (4M x 8) Flash A/D 24x12b Internal
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RFQ
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RFQ
1,054
In-stock
NXP USA Inc. ARM 32-BIT MCU TRIPLE CORE 4MB MAC57Dxxx Active Tray -40°C ~ 105°C (TA) 208-LQFP Exposed Pad 208-LQFP (28x28) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 4MB (4M x 8) Flash A/D 24x12b Internal
SAC57D54HCVLT
RFQ
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RFQ
603
In-stock
NXP USA Inc. IC MCU 32BIT 4MB FLASH 208LQFP MAC57Dxxx Active Tray -40°C ~ 105°C (TA) 208-LQFP Exposed Pad 208-LQFP (28x28) DMA, LCD, LVD/HVD, POR, PWM, WDT ARM® Cortex®-A5, -M4, -M0+ 80MHz, 160MHz, 320MHz 3.15 V ~ 5.5 V - 2.3M x 8 32-Bit Tri-Core CAN, EBI/EMI, Ethernet, I²C, LIN, SPI 4MB (4M x 8) Flash A/D 24x12b Internal