Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Technology Operating Temperature Mounting Type Package / Case Supplier Device Package FET Type FET Feature Drain to Source Voltage (Vdss) Current - Continuous Drain (Id) @ 25°C Rds On (Max) @ Id, Vgs Vgs(th) (Max) @ Id Gate Charge (Qg) (Max) @ Vgs Input Capacitance (Ciss) (Max) @ Vds Drive Voltage (Max Rds On, Min Rds On) Vgs (Max)
GLOBAL STOCKS
EPC2007
RFQ
VIEW
RFQ
1,234
In-stock
EPC TRANS GAN 100V 6A BUMPED DIE eGaN® Obsolete Digi-Reel® GaNFET (Gallium Nitride) -40°C ~ 125°C (TJ) Surface Mount Die Die Outline (5-Solder Bar) N-Channel - 100V 6A (Ta) 30 mOhm @ 6A, 5V 2.5V @ 1.2mA 2.8nC @ 5V 205pF @ 50V 5V +6V, -5V
EPC2007
RFQ
VIEW
RFQ
656
In-stock
EPC TRANS GAN 100V 6A BUMPED DIE eGaN® Obsolete Cut Tape (CT) GaNFET (Gallium Nitride) -40°C ~ 125°C (TJ) Surface Mount Die Die Outline (5-Solder Bar) N-Channel - 100V 6A (Ta) 30 mOhm @ 6A, 5V 2.5V @ 1.2mA 2.8nC @ 5V 205pF @ 50V 5V +6V, -5V
EPC2007
RFQ
VIEW
RFQ
2,689
In-stock
EPC TRANS GAN 100V 6A BUMPED DIE eGaN® Obsolete Tape & Reel (TR) GaNFET (Gallium Nitride) -40°C ~ 125°C (TJ) Surface Mount Die Die Outline (5-Solder Bar) N-Channel - 100V 6A (Ta) 30 mOhm @ 6A, 5V 2.5V @ 1.2mA 2.8nC @ 5V 205pF @ 50V 5V +6V, -5V
EPC2014
RFQ
VIEW
RFQ
3,604
In-stock
EPC TRANS GAN 40V 10A BUMPED DIE eGaN® Discontinued at Digi-Key Digi-Reel® GaNFET (Gallium Nitride) -40°C ~ 150°C (TJ) Surface Mount Die Die Outline (5-Solder Bar) N-Channel - 40V 10A (Ta) 16 mOhm @ 5A, 5V 2.5V @ 2mA 2.8nC @ 5V 325pF @ 20V 5V +6V, -5V
EPC2014
RFQ
VIEW
RFQ
800
In-stock
EPC TRANS GAN 40V 10A BUMPED DIE eGaN® Discontinued at Digi-Key Cut Tape (CT) GaNFET (Gallium Nitride) -40°C ~ 150°C (TJ) Surface Mount Die Die Outline (5-Solder Bar) N-Channel - 40V 10A (Ta) 16 mOhm @ 5A, 5V 2.5V @ 2mA 2.8nC @ 5V 325pF @ 20V 5V +6V, -5V
EPC2014
RFQ
VIEW
RFQ
2,089
In-stock
EPC TRANS GAN 40V 10A BUMPED DIE eGaN® Discontinued at Digi-Key Tape & Reel (TR) GaNFET (Gallium Nitride) -40°C ~ 150°C (TJ) Surface Mount Die Die Outline (5-Solder Bar) N-Channel - 40V 10A (Ta) 16 mOhm @ 5A, 5V 2.5V @ 2mA 2.8nC @ 5V 325pF @ 20V 5V +6V, -5V
EPC2007C
RFQ
VIEW
RFQ
3,719
In-stock
EPC TRANS GAN 100V 6A BUMPED DIE eGaN® Active Digi-Reel® GaNFET (Gallium Nitride) -40°C ~ 150°C (TJ) Surface Mount Die Die Outline (5-Solder Bar) N-Channel - 100V 6A (Ta) 30 mOhm @ 6A, 5V 2.5V @ 1.2mA 2.2nC @ 5V 220pF @ 50V 5V +6V, -4V
EPC2007C
RFQ
VIEW
RFQ
2,299
In-stock
EPC TRANS GAN 100V 6A BUMPED DIE eGaN® Active Cut Tape (CT) GaNFET (Gallium Nitride) -40°C ~ 150°C (TJ) Surface Mount Die Die Outline (5-Solder Bar) N-Channel - 100V 6A (Ta) 30 mOhm @ 6A, 5V 2.5V @ 1.2mA 2.2nC @ 5V 220pF @ 50V 5V +6V, -4V
EPC2007C
RFQ
VIEW
RFQ
1,625
In-stock
EPC TRANS GAN 100V 6A BUMPED DIE eGaN® Active Tape & Reel (TR) GaNFET (Gallium Nitride) -40°C ~ 150°C (TJ) Surface Mount Die Die Outline (5-Solder Bar) N-Channel - 100V 6A (Ta) 30 mOhm @ 6A, 5V 2.5V @ 1.2mA 2.2nC @ 5V 220pF @ 50V 5V +6V, -4V
EPC2014C
RFQ
VIEW
RFQ
1,913
In-stock
EPC TRANS GAN 40V 10A BUMPED DIE eGaN® Active Digi-Reel® GaNFET (Gallium Nitride) -40°C ~ 150°C (TJ) Surface Mount Die Die Outline (5-Solder Bar) N-Channel - 40V 10A (Ta) 16 mOhm @ 10A, 5V 2.5V @ 2mA 2.5nC @ 5V 300pF @ 20V 5V +6V, -4V
EPC2014C
RFQ
VIEW
RFQ
1,635
In-stock
EPC TRANS GAN 40V 10A BUMPED DIE eGaN® Active Cut Tape (CT) GaNFET (Gallium Nitride) -40°C ~ 150°C (TJ) Surface Mount Die Die Outline (5-Solder Bar) N-Channel - 40V 10A (Ta) 16 mOhm @ 10A, 5V 2.5V @ 2mA 2.5nC @ 5V 300pF @ 20V 5V +6V, -4V
EPC2014C
RFQ
VIEW
RFQ
2,038
In-stock
EPC TRANS GAN 40V 10A BUMPED DIE eGaN® Active Tape & Reel (TR) GaNFET (Gallium Nitride) -40°C ~ 150°C (TJ) Surface Mount Die Die Outline (5-Solder Bar) N-Channel - 40V 10A (Ta) 16 mOhm @ 10A, 5V 2.5V @ 2mA 2.5nC @ 5V 300pF @ 20V 5V +6V, -4V