- Mounting Type :
- Features :
- Pitch - Mating :
- Contact Finish Thickness - Mating :
- Contact Material - Mating :
8 results
Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | |||||||||||||||||||||||
VIEW |
3,088
In-stock
|
Preci-Dip | CONN SOCKET BGA 292POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Tin | 292 (20 x 20) | Beryllium Copper | - | ||||
VIEW |
2,710
In-stock
|
Preci-Dip | CONN SOCKET BGA 292POS GOLD | 514 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | BGA | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 292 (20 x 20) | Beryllium Copper | - | ||||
VIEW |
946
In-stock
|
Preci-Dip | BGA PIN ADAPTER 1.27MM SMD | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 292 (20 x 20) | Beryllium Copper | 10.0µin (0.25µm) | ||||
VIEW |
1,803
In-stock
|
Preci-Dip | CONN SOCKET PGA 292POS GOLD | 518 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | Flash | Gold | 292 (20 x 20) | Beryllium Copper | Flash | ||||
VIEW |
2,313
In-stock
|
Preci-Dip | CONN SOCKET PGA 292POS GOLD | 518 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | Flash | Gold | 292 (20 x 20) | Beryllium Copper | Flash | ||||
VIEW |
1,498
In-stock
|
Preci-Dip | BGA SURFACE MOUNT 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Surface Mount | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 292 (20 x 20) | Brass | 10.0µin (0.25µm) | ||||
VIEW |
3,225
In-stock
|
Preci-Dip | PGA SOLDER TAIL 1.27MM | 558 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | PGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 292 (20 x 20) | Beryllium Copper | 10.0µin (0.25µm) | ||||
VIEW |
1,699
In-stock
|
Preci-Dip | BGA SOLDER TAIL | 550 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | BGA | FR4 Epoxy Glass | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Gold | 292 (20 x 20) | Brass | 10.0µin (0.25µm) |