Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
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3,079
In-stock
3M CONN ZIG-ZAG ZIF 51POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 51 (1 x 25, 1 x 26) Beryllium Copper
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RFQ
1,594
In-stock
3M CONN ZIG-ZAG ZIF 51POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 51 (1 x 25, 1 x 26) Beryllium Copper
251-5949-01-0602
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RFQ
2,126
In-stock
3M CONN ZIG-ZAG ZIF 51POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 51 (1 x 25, 1 x 26) Beryllium Copper
251-5949-02-0602
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RFQ
3,265
In-stock
3M CONN ZIG-ZAG ZIF 51POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 51 (1 x 25, 1 x 26) Beryllium Copper