Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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1,456
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Aries Electronics CONN IC DIP SOCKET 50POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 50 (2 x 25) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
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1,908
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Aries Electronics CONN IC DIP SOCKET 50POS GOLD 503 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Closed Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 50 (2 x 25) Beryllium Copper 10.0µin (0.25µm) Phosphor Bronze
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721
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Aries Electronics CONN IC DIP SOCKET 50POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 50 (2 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
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3,531
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Aries Electronics CONN IC DIP SOCKET 50POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 50 (2 x 25) Beryllium Copper 10.0µin (0.25µm) Brass
123-93-950-41-001000
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3,769
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,576
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 50 (2 x 25) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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2,224
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,878
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,734
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 104 Active Tube - Through Hole Press-Fit Open Frame DIP, 0.9" (22.86mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 50 (2 x 25) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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2,991
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 123 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,805
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 115 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,316
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,612
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,873
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,096
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 50 (2 x 25) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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820
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 122 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 50 (2 x 25) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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3,783
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 605 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,736
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 614 Active Tube -55°C ~ 125°C Through Hole Solder Carrier, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-93-950-41-001000
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2,726
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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944
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,420
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 126 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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905
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 121 Active Tube -55°C ~ 125°C Through Hole Wire Wrap Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 50 (2 x 25) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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2,481
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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901
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Aries Electronics CONN IC DIP SOCKET 50POS GOLD 518 Active Bulk - Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass
110-93-650-41-001000
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2,684
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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957
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
110-91-950-41-001000
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1,160
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 110 Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.9" (22.86mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,099
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 116 Active Tube -55°C ~ 125°C Through Hole Solder Elevated, Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,065
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 104 Active Tube - Through Hole Press-Fit Open Frame DIP, 0.6" (15.24mm) Row Spacing Thermoplastic 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 50 (2 x 25) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
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2,257
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 114 Active Tube -55°C ~ 125°C Surface Mount Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 50 (2 x 25) Beryllium Copper 200.0µin (5.08µm) Brass Alloy