- Part Status :
- Operating Temperature :
- Mounting Type :
- Termination :
- Features :
- Housing Material :
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- Polyamide (PA46), Nylon 4/6 (4)
- Polyamide (PA46), Nylon 4/6, Glass Filled (17)
- Polybutylene Terephthalate (PBT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (3)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (2)
- Contact Finish Thickness - Mating :
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28 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
3,241
In-stock
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Amphenol FCI | CONN SOCKET SIP 26POS GOLD | SIP050-1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 26 (1 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,507
In-stock
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Amphenol FCI | CONN SOCKET SIP 26POS TIN | SIP050-1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 26 (1 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,043
In-stock
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Aries Electronics | CONN SOCKET SIP 26POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (1 x 26) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
1,742
In-stock
|
Aries Electronics | CONN SOCKET SIP 26POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (1 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
2,284
In-stock
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Aries Electronics | CONN SOCKET SIP 26POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (1 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
2,931
In-stock
|
Aries Electronics | CONN SOCKET SIP 26POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 26 (1 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,080
In-stock
|
Aries Electronics | CONN SOCKET SIP 26POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 26 (1 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,766
In-stock
|
Aries Electronics | CONN SOCKET SIP 26POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 50.0µin (1.27µm) | Tin | 26 (1 x 26) | Phosphor Bronze | 50.0µin (1.27µm) | Phosphor Bronze | |||
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|
VIEW |
3,785
In-stock
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Aries Electronics | CONN SOCKET SIP 26POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 26 (1 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,628
In-stock
|
Aries Electronics | CONN SOCKET SIP 26POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (1 x 26) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
1,380
In-stock
|
Aries Electronics | CONN SOCKET SIP 26POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (1 x 26) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
2,939
In-stock
|
Aries Electronics | CONN SOCKET SIP 26POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 26 (1 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,249
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET SIP 26POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 26 (1 x 26) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | |||
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|
VIEW |
2,573
In-stock
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Aries Electronics | CONN SOCKET SIP 26POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 26 (1 x 26) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
3,979
In-stock
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Aries Electronics | CONN SOCKET SIP 26POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 26 (1 x 26) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
3,325
In-stock
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Aries Electronics | CONN SOCKET SIP 26POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 26 (1 x 26) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
1,731
In-stock
|
Aries Electronics | CONN SOCKET SIP 26POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 26 (1 x 26) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
1,784
In-stock
|
Aries Electronics | CONN SOCKET SIP 26POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 26 (1 x 26) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
3,699
In-stock
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Mill-Max Manufacturing Corp. | CONN SOCKET SIP 26POS GOLD | 346 | Active | Bulk | -55°C ~ 125°C | Through Hole | Press-Fit | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 26 (1 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
2,713
In-stock
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Aries Electronics | CONN SOCKET SIP 26POS GOLD | 518 | Active | Bulk | - | Surface Mount | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 26 (1 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
3,385
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET SIP 26POS GOLD | 346 | Active | Bulk | -55°C ~ 125°C | Through Hole | Press-Fit | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 26 (1 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
1,515
In-stock
|
Aries Electronics | CONN SOCKET SIP 26POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (1 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
2,395
In-stock
|
Aries Electronics | CONN SOCKET SIP 26POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 26 (1 x 26) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
2,558
In-stock
|
Aries Electronics | CONN SOCKET SIP 26POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 26 (1 x 26) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
1,816
In-stock
|
Harwin Inc. | CONN SOCKET SIP 26POS GOLD | D01-997 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 26 (1 x 26) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
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|
VIEW |
3,192
In-stock
|
Aries Electronics | CONN SOCKET SIP 26POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (1 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
2,873
In-stock
|
Omron Electronics Inc-EMC Div | CONN SOCKET SIP 26POS GOLD | XR2 | Active | Bulk | -55°C ~ 125°C | Threaded | Solder | - | SIP | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (1 x 26) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
3,619
In-stock
|
Aries Electronics | CONN SOCKET SIP 26POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 26 (1 x 26) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
