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44 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
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VIEW |
1,567
In-stock
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Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 26POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 26 (2 x 13) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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VIEW |
1,016
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 26 (2 x 13) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
986
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | Correct-A-Chip® 1109800 | Active | Bulk | - | Through Hole | Solder | Programmable | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin-Lead | 26 (2 x 13) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,499
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS TIN | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 26 (2 x 13) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
3,875
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (2 x 13) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
1,260
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (2 x 13) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,794
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 26 (2 x 13) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
864
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 26 (2 x 13) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,733
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 26 (2 x 13) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
2,805
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 26 (2 x 13) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
940
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 26 (2 x 13) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
2,786
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 26 (2 x 13) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,022
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 26 (2 x 13) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,692
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 8 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Closed Frame, Elevated | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 26 (2 x 13) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
2,538
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 26 (2 x 13) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,313
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 26 (2 x 13) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,171
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (2 x 13) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
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VIEW |
2,526
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 503 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (2 x 13) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
2,544
In-stock
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Preci-Dip | CONN IC DIP SOCKET 26POS GOLD | 299 | Active | Tube | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 26 (2 x 13) | Beryllium Copper | - | Brass | |||
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VIEW |
1,760
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | Vertisockets™ 800 | Active | Bulk | - | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (2 x 13) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
2,451
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS TIN | 6621 | Active | Bulk | -55°C ~ 105°C | Through Hole, Bottom Entry; Through Board | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 26 (2 x 13) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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VIEW |
1,634
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 26 (2 x 13) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
3,194
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 26 (2 x 13) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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VIEW |
2,715
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (2 x 13) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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VIEW |
786
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | Lo-PRO®file, 513 | Active | Bulk | - | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (2 x 13) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
2,371
In-stock
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Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 26 (2 x 13) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,225
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 26 (2 x 13) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,202
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 26 (2 x 13) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,013
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 26 (2 x 13) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
1,329
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | Vertisockets™ 800 | Active | Bulk | -55°C ~ 105°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 26 (2 x 13) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
