- Part Status :
- Operating Temperature :
- Mounting Type :
- Termination :
- Features :
- Housing Material :
-
- Polyamide (PA), Nylon, Glass Filled (4)
- Polyamide (PA46), Nylon 4/6 (4)
- Polyamide (PA46), Nylon 4/6, Glass Filled (20)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (1)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (3)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (2)
- Thermoplastic, Glass Filled (2)
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
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36 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
3,457
In-stock
|
Amphenol FCI | CONN SOCKET SIP 23POS TIN | SIP050-1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 23 (1 x 23) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
3,786
In-stock
|
Amphenol FCI | CONN SOCKET SIP 23POS GOLD | SIP050-1x | Obsolete | Bulk | - | Through Hole | Solder | Closed Frame | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 23 (1 x 23) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
1,949
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 23POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 23 (1 x 23) | Phosphor Bronze | - | Phosphor Bronze | |||
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|
VIEW |
1,717
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 23 (1 x 23) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
1,367
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 23 (1 x 23) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
3,181
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS GOLD | 511 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 23 (1 x 23) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
1,018
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS TIN | 511 | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 50.0µin (1.27µm) | Tin | 23 (1 x 23) | Phosphor Bronze | 50.0µin (1.27µm) | Phosphor Bronze | |||
|
VIEW |
3,475
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET SIP 23POS GOLD | 714 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | Carrier | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 23 (1 x 23) | Beryllium Copper | 30.0µin (0.76µm) | Brass Alloy | |||
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|
VIEW |
1,433
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS GOLD | 518 | Active | Bulk | - | Surface Mount | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 23 (1 x 23) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
2,813
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 23 (1 x 23) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
1,090
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS TIN | 700 Elevator Strip-Line™ | Active | Bulk | -55°C ~ 105°C | Through Hole | Solder | Elevated | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 23 (1 x 23) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
2,375
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS GOLD | 0513 | Active | Bulk | - | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 23 (1 x 23) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
954
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 23 (1 x 23) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
3,176
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS TIN | 501 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Tin | 23 (1 x 23) | Phosphor Bronze | 200.0µin (5.08µm) | Phosphor Bronze | |||
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|
VIEW |
900
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS GOLD | 0503 | Active | Bulk | - | Through Hole | Wire Wrap | - | SIP | Polyamide (PA), Nylon, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 23 (1 x 23) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
3,632
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS GOLD | 0503 | Active | Bulk | - | Through Hole | Wire Wrap | - | SIP | Polyamide (PA), Nylon, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 23 (1 x 23) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
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|
VIEW |
734
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS GOLD | 0503 | Active | Bulk | - | Through Hole | Wire Wrap | - | SIP | Polyamide (PA), Nylon, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 23 (1 x 23) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
2,571
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS GOLD | 0503 | Active | Bulk | - | Through Hole | Wire Wrap | - | SIP | Polyamide (PA), Nylon, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 23 (1 x 23) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
2,471
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS GOLD | 0513 | Active | Bulk | - | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 23 (1 x 23) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
]-1xx-41-013000.jpg)
|
VIEW |
1,793
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET SIP 23POS GOLD | 346 | Active | Bulk | -55°C ~ 125°C | Through Hole | Press-Fit | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 23 (1 x 23) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
2,928
In-stock
|
Mill-Max Manufacturing Corp. | CONN SOCKET SIP 23POS GOLD | 346 | Active | Bulk | -55°C ~ 125°C | Through Hole | Press-Fit | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 23 (1 x 23) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
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|
VIEW |
3,879
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS GOLD | 0517 | Active | Bulk | - | Through Hole, Right Angle | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | - | Gold | 30.0µin (0.76µm) | Tin | 23 (1 x 23) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,536
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 23 (1 x 23) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,936
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS GOLD | 518 | Active | Bulk | - | Through Hole | Solder | Open Frame | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 23 (1 x 23) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
3,725
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS GOLD | 0513 | Active | Bulk | - | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 23 (1 x 23) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
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|
VIEW |
3,153
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS GOLD | 0513 | Active | Bulk | - | Through Hole | Solder | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 23 (1 x 23) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,349
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 23 (1 x 23) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
1,420
In-stock
|
Aries Electronics | CONN SOCKET SIP 23POS GOLD | 501 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | - | SIP | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 23 (1 x 23) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
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|
VIEW |
2,593
In-stock
|
TE Connectivity AMP Connectors | CONN SOCKET SIP 23POS TIN | Diplomate DL | Active | Tube | -55°C ~ 105°C | Through Hole | Solder | Closed Frame | SIP | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 23 (1 x 23) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
2,995
In-stock
|
Harwin Inc. | CONN SOCKET SIP 23POS GOLD | D01-997 | Active | Bulk | -55°C ~ 125°C | Through Hole | Solder | - | SIP | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | Flash | Tin | 23 (1 x 23) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
