Packaging :
Contact Finish - Post :
Contact Material - Mating :
Contact Finish Thickness - Post :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,582
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Amphenol FCI CONN SOCKET SIP 21POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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2,489
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Amphenol FCI CONN SOCKET SIP 21POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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3,300
In-stock
Amphenol FCI CONN SOCKET SIP 21POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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2,521
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 21POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 21 (1 x 21) Beryllium Copper - Beryllium Copper
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2,441
In-stock
Aries Electronics CONN SOCKET SIP 21POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 21 (1 x 21) Beryllium Copper 10.0µin (0.25µm) Brass
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3,282
In-stock
Aries Electronics CONN SOCKET SIP 21POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 21 (1 x 21) Beryllium Copper 10.0µin (0.25µm) Brass
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2,803
In-stock
Aries Electronics CONN SOCKET SIP 21POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 21 (1 x 21) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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2,228
In-stock
Aries Electronics CONN SOCKET SIP 21POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 21 (1 x 21) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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RFQ
1,326
In-stock
Aries Electronics CONN SOCKET SIP 21POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 21 (1 x 21) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
2,582
In-stock
Aries Electronics CONN SOCKET SIP 21POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 21 (1 x 21) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
3,634
In-stock
Aries Electronics CONN SOCKET SIP 21POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 21 (1 x 21) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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704
In-stock
Aries Electronics CONN SOCKET SIP 21POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 21 (1 x 21) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,529
In-stock
Aries Electronics CONN SOCKET SIP 21POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
3,417
In-stock
Aries Electronics CONN SOCKET SIP 21POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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2,611
In-stock
Aries Electronics CONN SOCKET SIP 21POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 21 (1 x 21) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,211
In-stock
Aries Electronics CONN SOCKET SIP 21POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 21 (1 x 21) Phosphor Bronze 50.0µin (1.27µm) Phosphor Bronze
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1,352
In-stock
Aries Electronics CONN SOCKET SIP 21POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 21 (1 x 21) Beryllium Copper 10.0µin (0.25µm) Brass
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1,623
In-stock
Aries Electronics CONN SOCKET SIP 21POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 21 (1 x 21) Beryllium Copper 10.0µin (0.25µm) Brass
346-43-121-41-013000
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RFQ
2,131
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 21POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
346-93-121-41-013000
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RFQ
2,299
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 21POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,143
In-stock
Aries Electronics CONN SOCKET SIP 21POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 21 (1 x 21) Beryllium Copper 10.0µin (0.25µm) Brass
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1,226
In-stock
Aries Electronics CONN SOCKET SIP 21POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 21 (1 x 21) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
2,149
In-stock
Aries Electronics CONN SOCKET SIP 21POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
2,346
In-stock
Aries Electronics CONN SOCKET SIP 21POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 21 (1 x 21) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
1,415
In-stock
Aries Electronics CONN SOCKET SIP 21POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 21 (1 x 21) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
2,660
In-stock
Aries Electronics CONN SOCKET SIP 21POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
2,988
In-stock
Aries Electronics CONN SOCKET SIP 21POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
2,853
In-stock
Aries Electronics CONN SOCKET SIP 21POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
3,213
In-stock
Aries Electronics CONN SOCKET SIP 21POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 21 (1 x 21) Beryllium Copper 10.0µin (0.25µm) Brass
317-93-121-41-005000
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3,676
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 21POS GOLD 317 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.070" (1.78mm) Gold 30.0µin (0.76µm) Tin-Lead 21 (1 x 21) Beryllium Copper 200.0µin (5.08µm) Brass Alloy