Packaging :
Contact Finish - Mating :
Contact Material - Mating :
Contact Finish Thickness - Post :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,236
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Harwin Inc. CONN SOCKET SIP 14POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 14 (1 x 14) Beryllium Copper - Brass
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1,470
In-stock
Amphenol FCI CONN SOCKET SIP 14POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 14 (1 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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3,609
In-stock
Amphenol FCI CONN SOCKET SIP 14POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (1 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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1,180
In-stock
Amphenol FCI CONN SOCKET SIP 14POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (1 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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3,814
In-stock
Amphenol FCI CONN SOCKET SIP 14POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (1 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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2,172
In-stock
3M CONN SOCKET SIP 14POS GOLD 300 Obsolete - - Through Hole - Closed Frame SIP - 0.100" (2.54mm) Gold 8.00µin (0.203µm) Gold 14 (1 x 14) - 8.00µin (0.203µm) -
643646-3
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2,264
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 14POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 14 (1 x 14) Phosphor Bronze - Phosphor Bronze
643646-1
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746
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 14POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 14 (1 x 14) Beryllium Copper - Beryllium Copper
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3,723
In-stock
Aries Electronics CONN SOCKET SIP 14POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (1 x 14) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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813
In-stock
Aries Electronics CONN SOCKET SIP 14POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 14 (1 x 14) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,425
In-stock
Aries Electronics CONN SOCKET SIP 14POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 14 (1 x 14) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,379
In-stock
Aries Electronics CONN SOCKET SIP 14POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (1 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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1,615
In-stock
Aries Electronics CONN SOCKET SIP 14POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 14 (1 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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3,193
In-stock
Aries Electronics CONN SOCKET SIP 14POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (1 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
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1,755
In-stock
Aries Electronics CONN SOCKET SIP 14POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (1 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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3,101
In-stock
Aries Electronics CONN SOCKET SIP 14POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (1 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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3,282
In-stock
Aries Electronics CONN SOCKET SIP 14POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (1 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
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2,709
In-stock
Aries Electronics CONN SOCKET SIP 14POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 14 (1 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
1,653
In-stock
Aries Electronics CONN SOCKET SIP 14POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (1 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
3,910
In-stock
Aries Electronics CONN SOCKET SIP 14POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 14 (1 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
2,381
In-stock
Aries Electronics CONN SOCKET SIP 14POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 14 (1 x 14) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
3,307
In-stock
Aries Electronics CONN SOCKET SIP 14POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 14 (1 x 14) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
2,673
In-stock
Aries Electronics CONN SOCKET SIP 14POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 14 (1 x 14) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
3,371
In-stock
Aries Electronics CONN SOCKET SIP 14POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 14 (1 x 14) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,657
In-stock
Aries Electronics CONN SOCKET SIP 14POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 14 (1 x 14) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
3,605
In-stock
Aries Electronics CONN SOCKET SIP 14POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 14 (1 x 14) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
2,987
In-stock
Aries Electronics CONN SOCKET SIP 14POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 14 (1 x 14) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,142
In-stock
Aries Electronics CONN SOCKET SIP 14POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 14 (1 x 14) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,297
In-stock
Harwin Inc. CONN SOCKET SIP 14POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 14 (1 x 14) Beryllium Copper 196.9µin (5.00µm) Brass
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2,120
In-stock
Aries Electronics CONN SOCKET SIP 14POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 14 (1 x 14) Beryllium Copper 200.0µin (5.08µm) Brass