Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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979
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Amphenol FCI CONN SOCKET SIP 19POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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2,068
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Amphenol FCI CONN SOCKET SIP 19POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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3,386
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TE Connectivity AMP Connectors CONN SOCKET SIP 19POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 19 (1 x 19) Phosphor Bronze - Phosphor Bronze
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626
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Aries Electronics CONN SOCKET SIP 19POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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1,030
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Aries Electronics CONN SOCKET SIP 19POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 19 (1 x 19) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
346-43-119-41-013000
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2,616
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 19POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,273
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Aries Electronics CONN SOCKET SIP 19POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 19 (1 x 19) Beryllium Copper 10.0µin (0.25µm) Brass
346-93-119-41-013000
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2,109
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 19POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,609
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Aries Electronics CONN SOCKET SIP 19POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 19 (1 x 19) Beryllium Copper 10.0µin (0.25µm) Brass
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920
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Aries Electronics CONN SOCKET SIP 19POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 19 (1 x 19) Beryllium Copper 10.0µin (0.25µm) Brass
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1,252
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Aries Electronics CONN SOCKET SIP 19POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 19 (1 x 19) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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2,389
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Aries Electronics CONN SOCKET SIP 19POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 19 (1 x 19) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,739
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Aries Electronics CONN SOCKET SIP 19POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 19 (1 x 19) Beryllium Copper 10.0µin (0.25µm) Brass
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3,841
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Aries Electronics CONN SOCKET SIP 19POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 19 (1 x 19) Beryllium Copper 10.0µin (0.25µm) Brass
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1,369
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Aries Electronics CONN SOCKET SIP 19POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 19 (1 x 19) Beryllium Copper 10.0µin (0.25µm) Brass
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1,982
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Aries Electronics CONN SOCKET SIP 19POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 19 (1 x 19) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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905
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Aries Electronics CONN SOCKET SIP 19POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 19 (1 x 19) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,508
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Aries Electronics CONN SOCKET SIP 19POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 19 (1 x 19) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,278
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Aries Electronics CONN SOCKET SIP 19POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 19 (1 x 19) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,223
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Aries Electronics CONN SOCKET SIP 19POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 19 (1 x 19) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,649
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Aries Electronics CONN SOCKET SIP 19POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 19 (1 x 19) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,078
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Aries Electronics CONN SOCKET SIP 19POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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601
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Aries Electronics CONN SOCKET SIP 19POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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773
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Aries Electronics CONN SOCKET SIP 19POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 19 (1 x 19) Beryllium Copper 10.0µin (0.25µm) Brass
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3,526
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Aries Electronics CONN SOCKET SIP 19POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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3,472
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Aries Electronics CONN SOCKET SIP 19POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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2,278
In-stock
Aries Electronics CONN SOCKET SIP 19POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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1,791
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Harwin Inc. CONN SOCKET SIP 19POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 19 (1 x 19) Beryllium Copper 196.9µin (5.00µm) Brass
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1,481
In-stock
Aries Electronics CONN SOCKET SIP 19POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass
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821
In-stock
Aries Electronics CONN SOCKET SIP 19POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 19 (1 x 19) Beryllium Copper 200.0µin (5.08µm) Brass