Packaging :
Contact Finish - Post :
Contact Material - Mating :
Contact Finish Thickness - Post :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,306
In-stock
Amphenol FCI CONN SOCKET SIP 11POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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2,205
In-stock
Amphenol FCI CONN SOCKET SIP 11POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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1,664
In-stock
Amphenol FCI CONN SOCKET SIP 11POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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1,814
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 11POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 11 (1 x 11) Beryllium Copper - Beryllium Copper
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1,886
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 11POS 500 Obsolete Bulk - Through Hole Solder - SIP Thermoplastic 0.100" (2.54mm) - - - 11 (1 x 11) Beryllium Copper - Beryllium Copper
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990
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 11POS GOLD Diplomate DL Obsolete Tube -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 11 (1 x 11) Beryllium Copper 30.0µin (0.76µm) Beryllium Copper
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RFQ
1,769
In-stock
Aries Electronics CONN SOCKET SIP 11POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 11 (1 x 11) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,273
In-stock
Aries Electronics CONN SOCKET SIP 11POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 11 (1 x 11) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
3,015
In-stock
Aries Electronics CONN SOCKET SIP 11POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 11 (1 x 11) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,700
In-stock
Aries Electronics CONN SOCKET SIP 11POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 11 (1 x 11) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
714-43-111-31-018000
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RFQ
2,057
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 11POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 11 (1 x 11) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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805
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
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2,840
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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VIEW
RFQ
1,805
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
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2,512
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 11POS - Active Bulk - - - - SIP - - - - - 11 (1 x 11) - - -
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2,709
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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RFQ
3,108
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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2,270
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
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VIEW
RFQ
2,689
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
1,400
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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2,179
In-stock
Harwin Inc. CONN SOCKET SIP 11POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 11 (1 x 11) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
3,878
In-stock
Aries Electronics CONN SOCKET SIP 11POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 11 (1 x 11) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
2,249
In-stock
Aries Electronics CONN SOCKET SIP 11POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 11 (1 x 11) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
2,787
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
1,845
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
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913
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
1,934
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 11 (1 x 11) Beryllium Copper 10.0µin (0.25µm) Brass
346-93-111-41-013000
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RFQ
3,907
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 11POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
2,930
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass
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VIEW
RFQ
1,417
In-stock
Aries Electronics CONN SOCKET SIP 11POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 11 (1 x 11) Beryllium Copper 200.0µin (5.08µm) Brass