Packaging :
Contact Finish - Post :
Contact Material - Mating :
Contact Finish Thickness - Post :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,362
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Harwin Inc. CONN SOCKET SIP 9POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 9 (1 x 9) Beryllium Copper - Brass
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1,549
In-stock
Amphenol FCI CONN SOCKET SIP 9POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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2,486
In-stock
Amphenol FCI CONN SOCKET SIP 9POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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1,016
In-stock
Amphenol FCI CONN SOCKET SIP 9POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
643641-6
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RFQ
3,870
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 9POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 9 (1 x 9) Beryllium Copper - Beryllium Copper
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2,947
In-stock
Aries Electronics CONN SOCKET SIP 9POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 9 (1 x 9) Beryllium Copper 10.0µin (0.25µm) Brass
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630
In-stock
Aries Electronics CONN SOCKET SIP 9POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 9 (1 x 9) Beryllium Copper 10.0µin (0.25µm) Brass
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3,000
In-stock
Aries Electronics CONN SOCKET SIP 9POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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1,334
In-stock
Aries Electronics CONN SOCKET SIP 9POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 9 (1 x 9) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
3,000
In-stock
Aries Electronics CONN SOCKET SIP 9POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 9 (1 x 9) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
3,226
In-stock
Aries Electronics CONN SOCKET SIP 9POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 9 (1 x 9) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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RFQ
3,955
In-stock
Harwin Inc. CONN SOCKET SIP 9POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 9 (1 x 9) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
1,079
In-stock
Aries Electronics CONN SOCKET SIP 9POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 9 (1 x 9) Phosphor Bronze 50.0µin (1.27µm) Phosphor Bronze
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3,704
In-stock
Aries Electronics CONN SOCKET SIP 9POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
346-43-109-41-013000
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RFQ
2,428
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 9POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
346-93-109-41-013000
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RFQ
623
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 9POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,349
In-stock
Aries Electronics CONN SOCKET SIP 9POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
1,581
In-stock
Aries Electronics CONN SOCKET SIP 9POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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VIEW
RFQ
3,482
In-stock
Aries Electronics CONN SOCKET SIP 9POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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VIEW
RFQ
3,932
In-stock
Aries Electronics CONN SOCKET SIP 9POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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VIEW
RFQ
1,206
In-stock
Aries Electronics CONN SOCKET SIP 9POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 9 (1 x 9) Beryllium Copper 10.0µin (0.25µm) Brass
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VIEW
RFQ
2,684
In-stock
Aries Electronics CONN SOCKET SIP 9POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 9 (1 x 9) Beryllium Copper 10.0µin (0.25µm) Brass
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1,556
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 9POS GOLD 310 Active Tube -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
3,584
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 9POS GOLD 500 Active Bulk - Through Hole Solder - SIP Thermoplastic 0.100" (2.54mm) Gold - Gold 9 (1 x 9) Beryllium Copper - Beryllium Copper
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RFQ
2,148
In-stock
Aries Electronics CONN SOCKET SIP 9POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
2,819
In-stock
Aries Electronics CONN SOCKET SIP 9POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass
315-47-109-41-001000
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RFQ
2,149
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 9POS GOLD 315 Active Tube -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 9 (1 x 9) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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RFQ
3,234
In-stock
Aries Electronics CONN SOCKET SIP 9POS GOLD 700 Elevator Strip-Line™ Active Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 9 (1 x 9) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,494
In-stock
Aries Electronics CONN SOCKET SIP 9POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 9 (1 x 9) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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940
In-stock
Aries Electronics CONN SOCKET SIP 9POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 9 (1 x 9) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze