Packaging :
Contact Finish - Post :
Contact Material - Mating :
Contact Finish Thickness - Post :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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1,231
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Harwin Inc. CONN SOCKET SIP 18POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 18 (1 x 18) Beryllium Copper - Brass
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2,906
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Amphenol FCI CONN SOCKET SIP 18POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (1 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
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3,653
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Amphenol FCI CONN SOCKET SIP 18POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 18 (1 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
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3,830
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TE Connectivity AMP Connectors CONN SOCKET SIP 18POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 18 (1 x 18) Beryllium Copper - Beryllium Copper
643650-1
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2,126
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 18POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 18 (1 x 18) Beryllium Copper - Beryllium Copper
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1,997
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Aries Electronics CONN SOCKET SIP 18POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 18 (1 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
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2,121
In-stock
Aries Electronics CONN SOCKET SIP 18POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 18 (1 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
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3,707
In-stock
Aries Electronics CONN SOCKET SIP 18POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 18 (1 x 18) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,441
In-stock
Aries Electronics CONN SOCKET SIP 18POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 18 (1 x 18) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,183
In-stock
Aries Electronics CONN SOCKET SIP 18POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 18 (1 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
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3,058
In-stock
Aries Electronics CONN SOCKET SIP 18POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 18 (1 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
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3,059
In-stock
Aries Electronics CONN SOCKET SIP 18POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (1 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
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3,132
In-stock
Aries Electronics CONN SOCKET SIP 18POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (1 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
346-43-118-41-013000
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1,661
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 18POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (1 x 18) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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3,123
In-stock
Aries Electronics CONN SOCKET SIP 18POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (1 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
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3,409
In-stock
Aries Electronics CONN SOCKET SIP 18POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 18 (1 x 18) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,906
In-stock
Aries Electronics CONN SOCKET SIP 18POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 18 (1 x 18) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,106
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Aries Electronics CONN SOCKET SIP 18POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 18 (1 x 18) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,017
In-stock
Aries Electronics CONN SOCKET SIP 18POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 18 (1 x 18) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,848
In-stock
Aries Electronics CONN SOCKET SIP 18POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 18 (1 x 18) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,786
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Aries Electronics CONN SOCKET SIP 18POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 18 (1 x 18) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
2,040
In-stock
Aries Electronics CONN SOCKET SIP 18POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 18 (1 x 18) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,810
In-stock
Aries Electronics CONN SOCKET SIP 18POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 18 (1 x 18) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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802
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Aries Electronics CONN SOCKET SIP 18POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (1 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
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2,514
In-stock
Aries Electronics CONN SOCKET SIP 18POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 18 (1 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
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3,535
In-stock
Aries Electronics CONN SOCKET SIP 18POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 18 (1 x 18) Beryllium Copper 10.0µin (0.25µm) Brass
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2,568
In-stock
Aries Electronics CONN SOCKET SIP 18POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (1 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
1,642
In-stock
Aries Electronics CONN SOCKET SIP 18POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (1 x 18) Beryllium Copper 200.0µin (5.08µm) Brass
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1,659
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Harwin Inc. CONN SOCKET SIP 18POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 18 (1 x 18) Beryllium Copper 196.9µin (5.00µm) Brass
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1,895
In-stock
Harwin Inc. CONN SOCKET SIP 18POS GOLD D01-995 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 18 (1 x 18) Beryllium Copper 196.9µin (5.00µm) Brass