Contact Finish - Post :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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3,828
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TE Connectivity AMP Connectors CONN IC DIP SOCKET 3POS GOLD 800 Active Bulk -55°C ~ 105°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyester 0.100" (2.54mm) Gold 25.0µin (0.63µm) Tin-Lead 3 (1 x 3) Copper Alloy 80.0µin (2.03µm) Copper Alloy
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1,727
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Amphenol FCI CONN SOCKET SIP 3POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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3,954
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Amphenol FCI CONN SOCKET SIP 3POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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1,861
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Amphenol FCI CONN SOCKET SIP 3POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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3,950
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TE Connectivity AMP Connectors CONN SOCKET SIP 3POS GOLD 500 Obsolete Bulk - Through Hole Solder - SIP Thermoplastic 0.100" (2.54mm) Gold - Gold 3 (1 x 3) Beryllium Copper - Beryllium Copper
382437-3
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2,992
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TE Connectivity AMP Connectors CONN SOCKET SIP 3POS TIN Diplomate DL Obsolete Tray -55°C ~ 105°C Through Hole Solder - SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 3 (1 x 3) Phosphor Bronze - Phosphor Bronze
382437-1
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2,125
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TE Connectivity AMP Connectors CONN SOCKET SIP 3POS TIN Diplomate DL Obsolete Tray -55°C ~ 105°C Through Hole Solder - SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 3 (1 x 3) Phosphor Bronze - Phosphor Bronze
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811
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Aries Electronics CONN SOCKET SIP 3POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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2,221
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Aries Electronics CONN SOCKET SIP 3POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 3 (1 x 3) Phosphor Bronze 50.0µin (1.27µm) Phosphor Bronze
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3,465
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Aries Electronics CONN SOCKET SIP 3POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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2,099
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Aries Electronics CONN SOCKET SIP 3POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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3,453
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Aries Electronics CONN SOCKET SIP 3POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 3 (1 x 3) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,458
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Aries Electronics CONN SOCKET SIP 3POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 3 (1 x 3) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,825
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Aries Electronics CONN SOCKET SIP 3POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 3 (1 x 3) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,726
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Aries Electronics CONN SOCKET SIP 3POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 3 (1 x 3) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,681
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Aries Electronics CONN SOCKET SIP 3POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 3 (1 x 3) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,709
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Aries Electronics CONN SOCKET SIP 3POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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1,972
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Aries Electronics CONN SOCKET SIP 3POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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3,654
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Aries Electronics CONN SOCKET SIP 3POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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3,426
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Aries Electronics CONN SOCKET SIP 3POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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3,961
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Aries Electronics CONN SOCKET SIP 3POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
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3,323
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Aries Electronics CONN SOCKET SIP 3POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
714-43-103-31-018000
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3,149
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 3POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 3 (1 x 3) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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3,837
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Aries Electronics CONN SOCKET SIP 3POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,967
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Aries Electronics CONN SOCKET SIP 3POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,361
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Aries Electronics CONN SOCKET SIP 3POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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755
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Aries Electronics CONN SOCKET SIP 3POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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2,258
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Aries Electronics CONN SOCKET SIP 3POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 3 (1 x 3) Beryllium Copper 10.0µin (0.25µm) Brass
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901
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Aries Electronics CONN SOCKET SIP 3POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass
346-93-103-41-013000
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3,112
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 3POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 3 (1 x 3) Beryllium Copper 200.0µin (5.08µm) Brass Alloy