Packaging :
Contact Finish - Post :
Contact Material - Mating :
Contact Finish Thickness - Post :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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2,665
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Harwin Inc. CONN SOCKET SIP 5POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 5 (1 x 5) Beryllium Copper - Brass
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3,954
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Amphenol FCI CONN SOCKET SIP 5POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 5 (1 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
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1,374
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Amphenol FCI CONN SOCKET SIP 5POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 5 (1 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
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2,105
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Amphenol FCI CONN SOCKET SIP 5POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 5 (1 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
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3,038
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Amphenol FCI CONN SOCKET SIP 5POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 5 (1 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
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1,451
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Amphenol FCI CONN SOCKET SIP 5POS TIN SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 150.0µin (3.81µm) Tin 5 (1 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
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847
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TE Connectivity AMP Connectors CONN SOCKET SIP 5POS TIN - Obsolete Bulk -55°C ~ 125°C Through Hole Solder Closed Frame SIP Thermoplastic, Polyester 0.100" (2.54mm) Tin 196.9µin (5.00µm) Tin 5 (1 x 5) Beryllium Copper 196.9µin (5.00µm) Brass
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3,520
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Aries Electronics CONN SOCKET SIP 5POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 5 (1 x 5) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,969
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Aries Electronics CONN SOCKET SIP 5POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 5 (1 x 5) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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1,537
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Aries Electronics CONN SOCKET SIP 5POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 5 (1 x 5) Phosphor Bronze 50.0µin (1.27µm) Phosphor Bronze
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3,029
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Aries Electronics CONN SOCKET SIP 5POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 5 (1 x 5) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,979
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Aries Electronics CONN SOCKET SIP 5POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 5 (1 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
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3,973
In-stock
Aries Electronics CONN SOCKET SIP 5POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 5 (1 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
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2,473
In-stock
Harwin Inc. CONN SOCKET SIP 5POS GOLD D01-995 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 5 (1 x 5) Beryllium Copper 196.9µin (5.00µm) Brass
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1,637
In-stock
Aries Electronics CONN SOCKET SIP 5POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 5 (1 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
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3,881
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Aries Electronics CONN SOCKET SIP 5POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 5 (1 x 5) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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3,694
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Aries Electronics CONN SOCKET SIP 5POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 5 (1 x 5) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,337
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Aries Electronics CONN SOCKET SIP 5POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 5 (1 x 5) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,746
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Aries Electronics CONN SOCKET SIP 5POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 5 (1 x 5) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,669
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Aries Electronics CONN SOCKET SIP 5POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 5 (1 x 5) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,719
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Aries Electronics CONN SOCKET SIP 5POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 5 (1 x 5) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,749
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Aries Electronics CONN SOCKET SIP 5POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 5 (1 x 5) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,108
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Aries Electronics CONN SOCKET SIP 5POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 5 (1 x 5) Beryllium Copper 10.0µin (0.25µm) Brass
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973
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Aries Electronics CONN SOCKET SIP 5POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 5 (1 x 5) Beryllium Copper 10.0µin (0.25µm) Brass
714-43-105-31-018000
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3,911
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 5POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 5 (1 x 5) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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1,731
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Aries Electronics CONN SOCKET SIP 5POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 5 (1 x 5) Beryllium Copper 10.0µin (0.25µm) Brass
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3,657
In-stock
Aries Electronics CONN SOCKET SIP 5POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 5 (1 x 5) Beryllium Copper 10.0µin (0.25µm) Brass
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3,367
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Aries Electronics CONN SOCKET SIP 5POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 5 (1 x 5) Beryllium Copper 200.0µin (5.08µm) Brass
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2,021
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TE Connectivity AMP Connectors CONN SOCKET SIP 5POS - Active Bulk - - - - SIP - - - - - 5 (1 x 5) - - -
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1,109
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Aries Electronics CONN SOCKET SIP 5POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 5 (1 x 5) Beryllium Copper 200.0µin (5.08µm) Brass