Packaging :
Contact Finish - Post :
Contact Material - Mating :
Contact Finish Thickness - Post :
Contact Material - Post :
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
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3,973
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Harwin Inc. CONN SOCKET SIP 12POS GOLD D01-950 Obsolete Bulk -55°C ~ 125°C Through Hole Solder Elevated SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin 12 (1 x 12) Beryllium Copper - Brass
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2,002
In-stock
Amphenol FCI CONN SOCKET SIP 12POS GOLD SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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1,163
In-stock
Amphenol FCI CONN SOCKET SIP 12POS TIN SIP050-1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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3,156
In-stock
Amphenol FCI CONN SOCKET SIP 12POS GOLD SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
979
In-stock
Amphenol FCI CONN SOCKET SIP 12POS TIN SIP1x Obsolete Bulk - Through Hole Solder Closed Frame SIP Polyphenylene Sulfide (PPS), Glass Filled 0.100" (2.54mm) Tin 150.0µin (3.81µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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3,381
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 12POS 500 Obsolete Bulk - Through Hole Solder - SIP Thermoplastic 0.100" (2.54mm) - - - 12 (1 x 12) Beryllium Copper - Beryllium Copper
643644-1
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RFQ
2,129
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 12POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 12 (1 x 12) Beryllium Copper - Beryllium Copper
643644-3
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RFQ
1,603
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 12POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 12 (1 x 12) Phosphor Bronze - Phosphor Bronze
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RFQ
1,202
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 12POS TIN Diplomate DL Obsolete Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 12 (1 x 12) Beryllium Copper - Beryllium Copper
714-43-112-31-018000
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693
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 12POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 12 (1 x 12) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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3,370
In-stock
Aries Electronics CONN SOCKET SIP 12POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
3,794
In-stock
Aries Electronics CONN SOCKET SIP 12POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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1,730
In-stock
Aries Electronics CONN SOCKET SIP 12POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 12 (1 x 12) Beryllium Copper 10.0µin (0.25µm) Brass
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RFQ
3,564
In-stock
Harwin Inc. CONN SOCKET SIP 12POS GOLD D01-995 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
1,985
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 12POS TIN Diplomate DL Active Tube -55°C ~ 105°C Through Hole Solder Closed Frame SIP Thermoplastic, Glass Filled 0.100" (2.54mm) Tin - Tin 12 (1 x 12) Phosphor Bronze - Phosphor Bronze
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RFQ
1,520
In-stock
TE Connectivity AMP Connectors CONN SOCKET SIP 12POS GOLD 500 Active Bulk - Through Hole Solder - SIP Thermoplastic 0.100" (2.54mm) Gold - Gold 12 (1 x 12) Beryllium Copper - Beryllium Copper
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RFQ
687
In-stock
Aries Electronics CONN SOCKET SIP 12POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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2,243
In-stock
Aries Electronics CONN SOCKET SIP 12POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 12 (1 x 12) Beryllium Copper 200.0µin (5.08µm) Brass
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RFQ
1,981
In-stock
Harwin Inc. CONN SOCKET SIP 12POS GOLD D01-997 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled 0.100" (2.54mm) Gold Flash Tin 12 (1 x 12) Beryllium Copper 196.9µin (5.00µm) Brass
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RFQ
1,172
In-stock
Aries Electronics CONN SOCKET SIP 12POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
3,899
In-stock
Aries Electronics CONN SOCKET SIP 12POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
2,933
In-stock
Aries Electronics CONN SOCKET SIP 12POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
3,894
In-stock
Aries Electronics CONN SOCKET SIP 12POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
1,259
In-stock
Aries Electronics CONN SOCKET SIP 12POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
VIEW
RFQ
1,036
In-stock
Aries Electronics CONN SOCKET SIP 12POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
VIEW
RFQ
1,038
In-stock
Aries Electronics CONN SOCKET SIP 12POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 12 (1 x 12) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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RFQ
1,998
In-stock
Aries Electronics CONN SOCKET SIP 12POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 12 (1 x 12) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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RFQ
3,812
In-stock
Aries Electronics CONN SOCKET SIP 12POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 12 (1 x 12) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
12-0511-10
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RFQ
1,977
In-stock
Aries Electronics CONN SOCKET SIP 12POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 12 (1 x 12) Phosphor Bronze 50.0µin (1.27µm) Phosphor Bronze
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RFQ
3,470
In-stock
Aries Electronics CONN SOCKET SIP 12POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 12 (1 x 12) Beryllium Copper 10.0µin (0.25µm) Brass