Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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1,545
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Aries Electronics CONN SOCKET SIP 1POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled - Gold 30.0µin (0.76µm) Tin 1 (1 x 1) Beryllium Copper 30.0µin (0.76µm) Brass
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3,326
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Aries Electronics CONN SOCKET SIP 1POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled - Gold 30.0µin (0.76µm) Tin 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass
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2,915
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Aries Electronics CONN SOCKET SIP 1POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 - Gold 10.0µin (0.25µm) Tin 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass
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1,932
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Aries Electronics CONN SOCKET SIP 1POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 - Gold 10.0µin (0.25µm) Tin 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass
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701
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Aries Electronics CONN SOCKET SIP 1POS GOLD 0517 Active Bulk - Through Hole, Right Angle Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 30.0µin (0.76µm) Tin 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass
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3,978
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Aries Electronics CONN SOCKET SIP 1POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 1 (1 x 1) Beryllium Copper 10.0µin (0.25µm) Brass
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2,951
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Aries Electronics CONN SOCKET SIP 1POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 10.0µin (0.25µm) Gold 1 (1 x 1) Beryllium Copper 10.0µin (0.25µm) Brass
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3,709
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Aries Electronics CONN SOCKET SIP 1POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass
714-43-101-31-018000
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929
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 1POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 1 (1 x 1) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
346-93-101-41-013000
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2,541
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 1POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,542
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Aries Electronics CONN SOCKET SIP 1POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 - Gold 10.0µin (0.25µm) Gold 1 (1 x 1) Beryllium Copper 10.0µin (0.25µm) Brass
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2,750
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Aries Electronics CONN SOCKET SIP 1POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 - Gold 10.0µin (0.25µm) Gold 1 (1 x 1) Beryllium Copper 10.0µin (0.25µm) Brass
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1,489
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Aries Electronics CONN SOCKET SIP 1POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled - Gold 30.0µin (0.76µm) Gold 1 (1 x 1) Beryllium Copper 30.0µin (0.76µm) Brass
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1,504
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Aries Electronics CONN SOCKET SIP 1POS GOLD 0503 Active Bulk - Through Hole Wire Wrap - SIP Polyamide (PA), Nylon, Glass Filled - Gold 30.0µin (0.76µm) Gold 1 (1 x 1) Beryllium Copper 10.0µin (0.25µm) Brass
315-47-101-41-001000
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2,347
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 1POS GOLD 315 Active Tube -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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747
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Aries Electronics CONN SOCKET SIP 1POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 10.0µin (0.25µm) Tin 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass
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2,834
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Aries Electronics CONN SOCKET SIP 1POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 10.0µin (0.25µm) Gold 1 (1 x 1) Beryllium Copper 10.0µin (0.25µm) Brass
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3,718
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Aries Electronics CONN SOCKET SIP 1POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 1 (1 x 1) Beryllium Copper 10.0µin (0.25µm) Brass
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2,243
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Aries Electronics CONN SOCKET SIP 1POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass
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1,130
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Aries Electronics CONN SOCKET SIP 1POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass
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3,876
In-stock
Aries Electronics CONN SOCKET SIP 1POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass
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2,483
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Aries Electronics CONN SOCKET SIP 1POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 10.0µin (0.25µm) Tin 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass
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3,781
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Aries Electronics CONN SOCKET SIP 1POS GOLD 0513 Active Bulk - Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled - Gold 10.0µin (0.25µm) Tin 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass
346-43-101-41-013000
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3,996
In-stock
Mill-Max Manufacturing Corp. CONN SOCKET SIP 1POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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2,504
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 1POS GOLD 310 Active Tube -55°C ~ 125°C Through Hole Solder - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold Flash Tin 1 (1 x 1) Beryllium Copper 200.0µin (5.08µm) Brass Alloy