Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
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3,000
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Aries Electronics CONN SOCKET SIP 40POS GOLD 511 Active Bulk -55°C ~ 125°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (1 x 40) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,886
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Aries Electronics CONN SOCKET SIP 40POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (1 x 40) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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828
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Aries Electronics CONN SOCKET SIP 40POS GOLD 501 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (1 x 40) Phosphor Bronze 10.0µin (0.25µm) Phosphor Bronze
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3,410
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Aries Electronics CONN SOCKET SIP 40POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (1 x 40) Beryllium Copper 200.0µin (5.08µm) Brass
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2,813
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Aries Electronics CONN SOCKET SIP 40POS GOLD 508 Active Bulk -55°C ~ 125°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (1 x 40) Beryllium Copper 200.0µin (5.08µm) Brass
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1,978
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Aries Electronics CONN SOCKET SIP 40POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (1 x 40) Beryllium Copper 10.0µin (0.25µm) Brass
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2,699
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Aries Electronics CONN SOCKET SIP 40POS GOLD 508 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (1 x 40) Beryllium Copper 10.0µin (0.25µm) Brass
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1,236
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Aries Electronics CONN SOCKET SIP 40POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 40 (1 x 40) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,377
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Aries Electronics CONN SOCKET SIP 40POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 40 (1 x 40) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,084
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Aries Electronics CONN SOCKET SIP 40POS TIN 700 Elevator Strip-Line™ Active Bulk -55°C ~ 105°C Through Hole Solder Elevated SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 40 (1 x 40) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,932
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Aries Electronics CONN SOCKET SIP 40POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (1 x 40) Beryllium Copper 200.0µin (5.08µm) Brass
714-43-140-31-018000
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891
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 40POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 40 (1 x 40) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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698
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Aries Electronics CONN SOCKET SIP 40POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 40 (1 x 40) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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2,255
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Aries Electronics CONN SOCKET SIP 40POS TIN 501 Active Bulk -55°C ~ 105°C Through Hole Wire Wrap - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 40 (1 x 40) Phosphor Bronze 200.0µin (5.08µm) Phosphor Bronze
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1,296
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Aries Electronics CONN SOCKET SIP 40POS TIN 511 Active Bulk -55°C ~ 105°C Through Hole Solder - SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Tin 50.0µin (1.27µm) Tin 40 (1 x 40) Phosphor Bronze 50.0µin (1.27µm) Phosphor Bronze
346-43-140-41-013000
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2,940
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 40POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 40 (1 x 40) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
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1,072
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Aries Electronics CONN SOCKET SIP 40POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (1 x 40) Beryllium Copper 10.0µin (0.25µm) Brass
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2,269
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Aries Electronics CONN SOCKET SIP 40POS GOLD 518 Active Bulk - Surface Mount Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (1 x 40) Beryllium Copper 200.0µin (5.08µm) Brass
346-93-140-41-013000
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2,114
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Mill-Max Manufacturing Corp. CONN SOCKET SIP 40POS GOLD 346 Active Bulk -55°C ~ 125°C Through Hole Press-Fit - SIP Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 40 (1 x 40) Beryllium Copper 200.0µin (5.08µm) Brass Alloy
40-0518-11
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2,831
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Aries Electronics CONN SOCKET SIP 40POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 40 (1 x 40) Beryllium Copper 10.0µin (0.25µm) Brass
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2,188
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Aries Electronics CONN SOCKET SIP 40POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (1 x 40) Beryllium Copper 200.0µin (5.08µm) Brass
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1,933
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Aries Electronics CONN SOCKET SIP 40POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (1 x 40) Beryllium Copper 200.0µin (5.08µm) Brass
40-0518-10
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2,541
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Aries Electronics CONN SOCKET SIP 40POS GOLD 518 Active Bulk - Through Hole Solder Open Frame SIP Polyamide (PA46), Nylon 4/6, Glass Filled 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 40 (1 x 40) Beryllium Copper 200.0µin (5.08µm) Brass