Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
Default Photo
RFQ
VIEW
RFQ
3,079
In-stock
3M CONN ZIG-ZAG ZIF 51POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 51 (1 x 25, 1 x 26) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,594
In-stock
3M CONN ZIG-ZAG ZIF 51POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 51 (1 x 25, 1 x 26) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,340
In-stock
3M CONN ZIG-ZAG ZIF 35POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 35 (1 x 17, 1 x 18) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,425
In-stock
3M CONN ZIG-ZAG ZIF 35POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 35 (1 x 17, 1 x 18) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,872
In-stock
3M CONN ZIG-ZAG ZIF 35POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 35 (1 x 17, 1 x 18) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
1,541
In-stock
3M CONN ZIG-ZAG ZIF 35POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 35 (1 x 17, 1 x 18) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
2,113
In-stock
3M CONN ZIG-ZAG ZIF 34POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 34 (2 x 17) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
2,128
In-stock
3M CONN ZIG-ZAG ZIF 34POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 34 (1 x 34) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
3,597
In-stock
3M CONN ZIG-ZAG ZIF 34POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 34 (2 x 17) Beryllium Copper
Default Photo
RFQ
VIEW
RFQ
941
In-stock
3M CONN ZIG-ZAG ZIF 34POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 34 (2 x 17) Beryllium Copper
251-5949-01-0602
RFQ
VIEW
RFQ
2,126
In-stock
3M CONN ZIG-ZAG ZIF 51POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 51 (1 x 25, 1 x 26) Beryllium Copper
251-5949-02-0602
RFQ
VIEW
RFQ
3,265
In-stock
3M CONN ZIG-ZAG ZIF 51POS GOLD Textool™ Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame Zig-Zag, ZIF (ZIP) Polysulfone (PSU), Glass Filled 0.050" (1.27mm) Gold 30.0µin (0.76µm) 51 (1 x 25, 1 x 26) Beryllium Copper