Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Contact Finish Thickness - Post Contact Material - Post
GLOBAL STOCKS
415-13-272-41-003000
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3,288
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 72POS GOLD 415 Active Bulk -55°C ~ 125°C Through Hole Solder Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 72 (2 x 36) Beryllium Copper 10.0µin (0.25µm) Brass Alloy
714-43-254-31-018000
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2,968
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 54POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 54 (2 x 27) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-240-31-018000
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1,902
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 40POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 40 (2 x 20) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-238-31-018000
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2,138
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 38POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 38 (2 x 19) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-236-31-018000
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3,168
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 36POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 36 (2 x 18) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
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1,440
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 416 Active - - - - Closed Frame DIP, 0.1" (2.54mm) Row Spacing - 0.100" (2.54mm) Gold 30.0µin (0.76µm) 64 (2 x 32) - - -
714-43-224-31-018000
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2,145
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 24POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 24 (2 x 12) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-222-31-018000
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1,853
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 22POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 22 (2 x 11) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-212-31-018000
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737
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 12POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 12 (2 x 6) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-262-31-018000
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1,837
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 62POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 62 (2 x 31) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-210-31-018000
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1,121
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 10POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 10 (2 x 5) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-256-31-018000
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1,097
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 56POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 56 (2 x 28) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-242-31-018000
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2,844
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 42POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 42 (2 x 21) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-258-31-018000
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3,020
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 58POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 58 (2 x 29) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-228-31-018000
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2,233
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 28POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 28 (2 x 14) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-226-31-018000
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2,432
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 26POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 26 (2 x 13) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-244-31-018000
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3,763
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 44POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 44 (2 x 22) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-216-31-018000
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1,774
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 16POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 16 (2 x 8) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-230-31-018000
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1,486
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 30POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 30 (2 x 15) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-214-31-018000
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703
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 14POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 14 (2 x 7) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-218-31-018000
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1,914
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 18POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 18 (2 x 9) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-204-31-018000
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3,301
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 4POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 4 (2 x 2) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-260-31-018000
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1,700
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 60POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 60 (2 x 30) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-252-31-018000
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908
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 52POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 52 (2 x 26) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-250-31-018000
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2,742
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 50POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 50 (2 x 25) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-248-31-018000
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749
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Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 48POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 48 (2 x 24) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-246-31-018000
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3,684
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 46POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 46 (2 x 23) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-264-31-018000
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2,251
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 64POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 64 (2 x 32) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-234-31-018000
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2,833
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 34POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 34 (2 x 17) Beryllium Copper 30.0µin (0.76µm) Brass Alloy
714-43-232-31-018000
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1,626
In-stock
Mill-Max Manufacturing Corp. CONN IC DIP SOCKET 32POS GOLD 714 Active Bulk -55°C ~ 125°C Through Hole Solder Carrier, Closed Frame DIP, 0.1" (2.54mm) Row Spacing Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 0.100" (2.54mm) Gold 30.0µin (0.76µm) 32 (2 x 16) Beryllium Copper 30.0µin (0.76µm) Brass Alloy