- Part Status :
- Packaging :
- Operating Temperature :
- Termination :
- Contact Finish Thickness - Mating :
- Contact Finish - Post :
- Number of Positions or Pins (Grid) :
-
- 10 (2 x 5) (124)
- 10 (2 x 5), 6 Loaded (3)
- 10 (2 x 5), 8 Loaded (3)
- 12 (2 x 6) (10)
- 14 (2 x 7) (10)
- 16 (2 x 8) (13)
- 18 (2 x 9) (10)
- 2 (1 x 2) (11)
- 20 (2 x 10) (10)
- 22 (2 x 11) (10)
- 24 (2 x 12) (10)
- 26 (2 x 13) (10)
- 28 (2 x 14) (10)
- 30 (2 x 15) (10)
- 32 (2 x 16) (10)
- 34 (2 x 17) (10)
- 36 (2 x 18) (10)
- 38 (2 x 19) (10)
- 4 (2 x 2) (10)
- 40 (2 x 20) (10)
- 42 (2 x 21) (2)
- 44 (2 x 22) (2)
- 56 (2 x 28) (1)
- 58 (2 x 29) (1)
- 6 (2 x 3) (20)
- 60 (2 x 30) (1)
- 8 (2 x 4) (47)
- Contact Material - Mating :
- Contact Material - Post :
- Applied Filters :
378 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
3,818
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 60POS GOLD | 518 | Obsolete | Bulk | - | Through Hole | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 60 (2 x 30) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
905
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 38 (2 x 19) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,665
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 38 (2 x 19) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,095
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,804
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 36POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 36 (2 x 18) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,356
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,641
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
884
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,307
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,460
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 42POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 42 (2 x 21) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
1,516
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 56POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 56 (2 x 28) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,960
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS GOLD | 123 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
706
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS GOLD | 124 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
667
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
2,551
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS GOLD | 126 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
2,959
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
712
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 32POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 32 (2 x 16) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,883
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,948
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 30POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 30 (2 x 15) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,078
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 34 (2 x 17) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
3,084
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 34 (2 x 17) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,424
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS GOLD | 121 | Active | Tube | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 10 (2 x 5) | Beryllium Copper | 10.0µin (0.25µm) | Brass Alloy | |||
|
|
VIEW |
1,039
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 38 (2 x 19) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
917
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 38POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 38 (2 x 19) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
2,072
In-stock
|
Mill-Max Manufacturing Corp. | CONN IC DIP SOCKET 10POS GOLD | 114 | Active | Tube | -55°C ~ 125°C | Surface Mount | Solder | Open Frame | DIP, 0.2" (5.08mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 10 (2 x 5) | Beryllium Copper | 200.0µin (5.08µm) | Brass Alloy | |||
|
|
VIEW |
2,154
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 18 (2 x 9) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,556
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 18 (2 x 9) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
2,892
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 34POS GOLD | 508 | Active | Bulk | -55°C ~ 105°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 34 (2 x 17) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
|
VIEW |
3,875
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (2 x 13) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
|
|
VIEW |
1,260
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 26POS GOLD | 508 | Active | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.2" (5.08mm) Row Spacing | Polyamide (PA46), Nylon 4/6 | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 26 (2 x 13) | Beryllium Copper | 10.0µin (0.25µm) | Brass | |||
