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- Aries Electronics (811)
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- CNC Tech (33)
- Harwin Inc. (24)
- Mill-Max Manufacturing Corp. (416)
- Molex, LLC (1)
- Omron Electronics Inc-EMC Div (13)
- On Shore Technology Inc. (25)
- Preci-Dip (611)
- Samtec Inc. (28)
- TE Connectivity AMP Connectors (227)
- TE Connectivity Potter & Brumfield Relays (1)
- Series :
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- Housing Material :
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- Aluminum Alloy (4)
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- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (619)
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- Pitch - Mating :
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-
- 10.0µin (0.25µm) (924)
- 100.0µin (2.54µm) (39)
- 135.0µin (3.43µm) (4)
- 15.0µin (0.38µm) (46)
- 20.0µin (0.51µm) (22)
- 25.0µin (0.63µm) (68)
- 29.5µin (0.75µm) (327)
- 30.0µin (0.76µm) (764)
- 35.4µin (0.90µm) (10)
- 5.00µin (0.127µm) (9)
- 60.0µin (1.52µm) (50)
- 78.7µin (2.00µm) (5)
- 8.00µin (0.203µm) (31)
- Flash (386)
- Number of Positions or Pins (Grid) :
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- Contact Material - Mating :
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- Applied Filters :
2302 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
3,094
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | 6556 | Active | Bulk | - | Through Hole | Solder Cup | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS), Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Brass | |||
|
VIEW |
3,215
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 30POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 30 (2 x 15) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
2,279
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 20POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Beryllium Copper | - | Beryllium Copper | |||
|
VIEW |
3,477
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS TIN | Diplomate DL | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 16 (2 x 8) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
1,455
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 32POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester, Glass Filled | 0.100" (2.54mm) | Tin | - | Tin | 32 (2 x 16) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,243
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS TINLEAD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 28 (2 x 14) | Copper Alloy | - | Copper Alloy | |||
|
|
VIEW |
2,091
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 24 (2 x 12) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
2,801
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Tin-Lead | 40 (2 x 20) | Phosphor Bronze | - | Phosphor Bronze | |||
|
VIEW |
2,539
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS GOLD | Diplomate DL | Obsolete | Tube | - | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Tin-Lead | 32 (2 x 16) | Beryllium Copper | - | Beryllium Copper | |||
|
|
VIEW |
1,044
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
2,924
In-stock
|
CNC Tech | CONN IC DIP SOCKET 48POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Tin | 48 (2 x 24) | Phosphor Bronze | 100.0µin (2.54µm) | Phosphor Bronze | |||
|
VIEW |
1,026
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | - | Obsolete | Cut Tape (CT) | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin | - | Tin | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | |||
|
|
VIEW |
2,320
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 32POS TIN | - | Obsolete | Tape & Reel (TR) | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin | - | Tin | 32 (2 x 16) | Phosphor Bronze | - | Phosphor Bronze | |||
|
|
VIEW |
1,137
In-stock
|
TE Connectivity Potter & Brumfield Relays | CONN IC DIP SOCKET 32POS TINLEAD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | - | 32 (2 x 16) | Copper Alloy | - | - | |||
|
|
VIEW |
2,886
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 28POS GOLD | IC | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 28 (2 x 14) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
3,634
In-stock
|
Molex, LLC | CONN IC DIP SOCKET 28POS TINLEAD | - | Obsolete | - | - | Through Hole | - | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Tin-Lead | - | - | 28 (2 x 14) | - | - | - | |||
|
VIEW |
993
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 48POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 48 (2 x 24) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,203
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 40POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,541
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 28POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,967
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 24POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 24 (2 x 12) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,115
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 40POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 40 (2 x 20) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
2,987
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 28POS GOLD | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Gold | - | Tin | 28 (2 x 14) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
1,037
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 40POS GOLD | - | Obsolete | - | - | Through Hole | - | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | Gold | 40 (2 x 20) | - | - | - | |||
|
VIEW |
2,834
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 28POS GOLD | - | Obsolete | - | - | Through Hole | - | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | Gold | 28 (2 x 14) | - | - | - | |||
|
VIEW |
1,867
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 24POS GOLD | - | Obsolete | - | - | Through Hole | - | Open Frame | DIP, 0.6" (15.24mm) Row Spacing | - | 0.100" (2.54mm) | Gold | - | Gold | 24 (2 x 12) | - | - | - | |||
|
VIEW |
1,057
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 40POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 40 (2 x 20) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
1,717
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 28POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
3,285
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Thermoplastic | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 24 (2 x 12) | Beryllium Copper | 15.0µin (0.38µm) | Beryllium Copper | |||
|
VIEW |
2,658
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | Edge-Grip™, C91 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 40 (2 x 20) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
1,237
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Edge-Grip™, C91 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Closed Frame | DIP, 0.6" (15.24mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 28 (2 x 14) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
