- Manufacture :
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- 3M (51)
- Adafruit Industries LLC (1)
- Amphenol FCI (20)
- Aries Electronics (816)
- Assmann WSW Components (92)
- CNC Tech (44)
- Harwin Inc. (40)
- Mill-Max Manufacturing Corp. (541)
- Omron Electronics Inc-EMC Div (14)
- On Shore Technology Inc. (38)
- Preci-Dip (791)
- Samtec Inc. (43)
- TE Connectivity AMP Connectors (286)
- Series :
-
- - (2005)
- 100 (28)
- 101 (7)
- 104 (22)
- 110 (288)
- 111 (22)
- 114 (82)
- 115 (91)
- 116 (345)
- 117 (6)
- 121 (23)
- 122 (41)
- 123 (75)
- 124 (23)
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- 146 (63)
- 210 (24)
- 214 (10)
- 299 (72)
- 4800 (14)
- 500 (76)
- 501 (22)
- 503 (72)
- 508 (80)
- 511 (13)
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- 612 (30)
- 614 (73)
- 700 (7)
- 8 (251)
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- D0 (14)
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- Lo-PRO®file, 513 (95)
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- Vertisockets™ 800 (121)
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- Part Status :
- Termination :
- Features :
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- Carrier, Closed Frame (7)
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- Open Frame, Wash Away (9)
- Programmable (11)
- Spacer (7)
- Housing Material :
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- Aluminum Alloy (7)
- Liquid Crystal Polymer (LCP) (8)
- Plastic (7)
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- Polyamide (PA), Nylon, Glass Filled (1)
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- Polyamide (PA46), Nylon 4/6, Glass Filled (747)
- Polybutylene Terephthalate (PBT) (41)
- Polybutylene Terephthalate (PBT), Glass Filled (63)
- Polybutylene Terephthalate (PBT), Thermoplastic, Glass Filled (8)
- Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled (32)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester (570)
- Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled (805)
- Polyester (65)
- Polyester, Glass Filled (58)
- Polyphenylene Sulfide (PPS), Glass Filled (28)
- Thermoplastic (39)
- Thermoplastic, Glass Filled (50)
- Thermoplastic, Polyester (82)
- Thermoplastic, Polyester, Glass Filled (17)
- Pitch - Mating :
- Contact Finish - Mating :
- Contact Finish Thickness - Mating :
-
- 100.0µin (2.54µm) (38)
- 15.0µin (0.38µm) (57)
- 20.0µin (0.51µm) (31)
- 25.0µin (0.63µm) (90)
- 29.5µin (0.75µm) (420)
- 3.00µin (0.076µm) (1)
- 30.0µin (0.76µm) (903)
- 35.4µin (0.90µm) (14)
- 5.00µin (0.127µm) (16)
- 50.0µin (1.27µm) (14)
- 60.0µin (1.52µm) (90)
- 78.7µin (2.00µm) (6)
- 8.00µin (0.203µm) (28)
- Flash (545)
- Number of Positions or Pins (Grid) :
-
- 10 (2 x 5) (127)
- 12 (2 x 6) (88)
- 12 (2 x 6), 6 Loaded (2)
- 14 (2 x 7) (402)
- 14 (2 x 7), 4 Loaded (3)
- 14 (2 x 7), 8 Loaded (5)
- 16 (2 x 8) (382)
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- 18 (2 x 9) (264)
- 2 (1 x 2) (1)
- 20 (2 x 10) (318)
- 22 (2 x 11) (108)
- 24 (2 x 12) (223)
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- 28 (2 x 14) (164)
- 28 (2 x 14), 14 Loaded (3)
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- 3 (1 x 3) (1)
- 30 (2 x 15) (13)
- 32 (2 x 16) (17)
- 320 (19 x 19) (1)
- 321 (21 x 21) (1)
- 325 (18 x 18) (1)
- 34 (2 x 17) (9)
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- 38 (2 x 19) (9)
- 4 (2 x 2) (81)
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- 6 (2 x 3) (183)
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- Contact Material - Mating :
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- Applied Filters :
2777 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Type | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||
|
VIEW |
1,182
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 18POS GOLD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | Flash | Tin-Lead | 18 (2 x 9) | Copper Alloy | 80.0µin (2.03µm) | Copper Alloy | |||
|
VIEW |
2,188
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 24POS TINLEAD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 24 (2 x 12) | Copper Alloy | - | Copper Alloy | |||
|
VIEW |
728
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS TINLEAD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 16 (2 x 8) | Copper Alloy | - | Copper Alloy | |||
|
VIEW |
2,912
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN-LEAD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 8 (2 x 4) | Copper Alloy | - | Copper Alloy | |||
|
|
VIEW |
3,956
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 8POS TIN-LEAD | 800 | Obsolete | Tube | -55°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Tin-Lead | - | Tin-Lead | 8 (2 x 4) | Copper Alloy | - | Copper Alloy | |||
|
VIEW |
3,272
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS GOLD | Diplomate DL | Obsolete | - | - | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | - | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 16 (2 x 8) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
1,184
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 14POS GOLD | Diplomate DL | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Glass Filled | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Gold | 14 (2 x 7) | Phosphor Bronze | 15.0µin (0.38µm) | Phosphor Bronze | |||
|
VIEW |
1,773
In-stock
|
TE Connectivity AMP Connectors | CONN IC DIP SOCKET 16POS GOLD | 500 | Obsolete | Tube | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester | 0.100" (2.54mm) | Gold | - | Gold | 16 (2 x 8) | Copper Alloy | - | Copper Alloy | |||
|
|
VIEW |
1,547
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 24 (2 x 12) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,573
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 20POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
728
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 18POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,185
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 16POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
1,890
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 14POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
1,060
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 8POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,934
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 6POS GOLD | D39 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole, Right Angle, Horizontal | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 6 (2 x 3) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
876
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 20POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 20 (2 x 10) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
2,860
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 18POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 18 (2 x 9) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
1,176
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 16POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 16 (2 x 8) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
2,187
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 14POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 14 (2 x 7) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,435
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 8POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 8 (2 x 4) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,550
In-stock
|
Harwin Inc. | CONN IC DIP SOCKET 6POS GOLD | D0 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Wire Wrap | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Tin | 6 (2 x 3) | Beryllium Copper | 196.9µin (5.00µm) | Brass | |||
|
|
VIEW |
3,598
In-stock
|
CNC Tech | CONN IC DIP SOCKET 6POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polybutylene Terephthalate (PBT), Glass Filled | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Tin | 6 (2 x 3) | Phosphor Bronze | 60.0µin (1.52µm) | Phosphor Bronze | |||
|
|
VIEW |
3,837
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 16POS GOLD | IC | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 16 (2 x 8) | Beryllium Copper | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
|
VIEW |
3,605
In-stock
|
Samtec Inc. | CONN IC DIP SOCKET 16POS GOLD | IC | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyester, Glass Filled | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Gold | 16 (2 x 8) | Beryllium Copper | 30.0µin (0.76µm) | Phosphor Bronze | |||
|
|
VIEW |
2,641
In-stock
|
Aries Electronics | CONN IC DIP SOCKET 14POS GOLD | Lo-PRO®file, C93 | Obsolete | Bulk | -55°C ~ 125°C | Through Hole | Solder | Closed Frame | DIP, 0.3" (7.62mm) Row Spacing | Polyamide (PA46), Nylon 4/6, Glass Filled | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Gold | 14 (2 x 7) | Phosphor Bronze | 10.0µin (0.25µm) | Phosphor Bronze | |||
|
VIEW |
2,153
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 20POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 20 (2 x 10) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,872
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 18POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 18 (2 x 9) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,557
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 16POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 16 (2 x 8) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
1,947
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 14POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 14 (2 x 7) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
|
VIEW |
3,115
In-stock
|
Assmann WSW Components | CONN IC DIP SOCKET 8POS TIN | - | Obsolete | Tube | -40°C ~ 105°C | Through Hole | Solder | Open Frame | DIP, 0.3" (7.62mm) Row Spacing | Thermoplastic, Polyester | 0.100" (2.54mm) | Tin | - | Tin | 8 (2 x 4) | Beryllium Copper | 200.0µin (5.08µm) | Beryllium Copper | |||
