Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
260-5204-01
RFQ
VIEW
RFQ
3,040
In-stock
3M CONN SOCKET QFN 60POS GOLD Textool™ Active Bulk - Through Hole Solder Open Frame QFN Polyethersulfone (PES) 0.020" (0.50mm) Gold - 60 (4 x 15) Beryllium Copper
280-5205-01
RFQ
VIEW
RFQ
3,533
In-stock
3M CONN SOCKET QFN 80POS GOLD Textool™ Active Tray - Through Hole Solder Open Frame QFN Polyethersulfone (PES) 0.020" (0.50mm) Gold - 80 (4 x 20) Beryllium Copper
260-4204-01
RFQ
VIEW
RFQ
1,506
In-stock
3M CONN SOCKET QFN 60POS GOLD Textool™ Active Bulk - Through Hole Solder Open Frame QFN Polyethersulfone (PES) 0.016" (0.40mm) Gold - 60 (4 x 15) Beryllium Copper
248-4205-01
RFQ
VIEW
RFQ
2,942
In-stock
3M CONN SOCKET QFN 48POS GOLD Textool™ Active Bulk - Through Hole Solder Closed Frame QFN Polyethersulfone (PES) 0.016" (0.40mm) Gold - 48 (4 x 12) Beryllium Copper
200-6313-9UN-1900
RFQ
VIEW
RFQ
2,422
In-stock
3M CONN SOCKET PGA ZIF 169POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder - PGA, ZIF (ZIP) Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) 169 (13 x 13) Beryllium Copper
200-6321-9UN-1900
RFQ
VIEW
RFQ
1,027
In-stock
3M CONN SOCKET PGA ZIF 441POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder - PGA, ZIF (ZIP) Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) 441 (21 x 21) Beryllium Copper
200-6319-9UN-1900
RFQ
VIEW
RFQ
3,760
In-stock
3M CONN SOCKET PGA ZIF 361POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder - PGA, ZIF (ZIP) Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) 361 (19 x 19) Beryllium Copper
224-5205-01
RFQ
VIEW
RFQ
2,324
In-stock
3M CONN SOCKET QFN 24POS GOLD Textool™ Active Bulk - Through Hole Solder - QFN Polyethersulfone (PES) 0.020" (0.50mm) Gold - 24 (4 x 6) Beryllium Copper
200-6310-9UN-1900
RFQ
VIEW
RFQ
1,447
In-stock
3M CONN SOCKET PGA ZIF 100POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder - PGA, ZIF (ZIP) Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) 100 (10 x 10) Beryllium Copper
232-5205-01
RFQ
VIEW
RFQ
1,037
In-stock
3M CONN SOCKET QFN 32POS GOLD Textool™ Active Bulk - Through Hole Solder Closed Frame QFN Polyethersulfone (PES) - Gold - 32 (4 x 8) Beryllium Copper
228-5204-01
RFQ
VIEW
RFQ
1,842
In-stock
3M CONN SOCKET QFN 28POS GOLD Textool™ Active Bulk - Through Hole Solder - QFN Polyethersulfone (PES) 0.020" (0.50mm) Gold - 28 (4 x 7) Beryllium Copper
216-5205-01
RFQ
VIEW
RFQ
2,525
In-stock
3M CONN SOCKET QFN 16POS GOLD Textool™ Active Bulk - Through Hole Solder - QFN Polyethersulfone (PES) 0.020" (0.50mm) Gold - 16 (4 x 4) Beryllium Copper
200-6315-9UN-1900
RFQ
VIEW
RFQ
3,394
In-stock
3M CONN SOCKET PGA ZIF 225POS GOLD Textool™ Active Bulk -55°C ~ 150°C - - - PGA, ZIF (ZIP) Polyethersulfone (PES) 0.100" (2.54mm) - - 225 (15 x 15) -
256-4205-01
RFQ
VIEW
RFQ
2,036
In-stock
3M CONN SOCKET QFN 56POS GOLD Textool™ Active Bulk - Through Hole Solder Open Frame QFN Polyethersulfone (PES) 0.016" (0.40mm) Gold - 56 (4 x 14) Beryllium Copper
248-5205-01
RFQ
VIEW
RFQ
3,945
In-stock
3M CONN SOCKET QFN 48POS GOLD Textool™ Active Bulk - Through Hole Solder Closed Frame QFN Polyethersulfone (PES) 0.020" (0.50mm) Gold - 48 (4 x 12) Beryllium Copper
240-5205-01
RFQ
VIEW
RFQ
2,214
In-stock
3M CONN SOCKET QFN 40POS GOLD Textool™ Active Bulk - Through Hole Solder Closed Frame QFN Polyethersulfone (PES) - Gold - 40 (4 x 10) Beryllium Copper
240-5205-00
RFQ
VIEW
RFQ
1,901
In-stock
3M CONN SOCKET QFN 40POS GOLD Textool™ Active Bulk - Through Hole Solder Closed Frame QFN Polyethersulfone (PES) - Gold - 40 (4 x 10) Beryllium Copper
200-6317-9UN-1900
RFQ
VIEW
RFQ
3,807
In-stock
3M CONN SOCKET PGA ZIF 289POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder - PGA, ZIF (ZIP) Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) 289 (17 x 17) Beryllium Copper
200-6325-9UN-1900
RFQ
VIEW
RFQ
2,894
In-stock
3M CONN SOCKET PGA ZIF 625POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder - PGA, ZIF (ZIP) Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) 625 (25 x 25) Beryllium Copper
248-5205-00
RFQ
VIEW
RFQ
1,922
In-stock
3M CONN SOCKET QFN 48POS GOLD Textool™ Active Bulk - Through Hole Solder Closed Frame QFN Polyethersulfone (PES) 0.020" (0.50mm) Gold - 48 (4 x 12) Beryllium Copper
288-4205-01
RFQ
VIEW
RFQ
2,779
In-stock
3M CONN SOCKET QFN 88POS GOLD Textool™ Active Tray - Through Hole Solder Open Frame QFN Polyethersulfone (PES) 0.016" (0.40mm) Gold - 88 (4 x 22) Beryllium Copper
264-5205-01
RFQ
VIEW
RFQ
1,990
In-stock
3M CONN SOCKET QFN 64POS GOLD Textool™ Active Bulk - Through Hole Solder Open Frame QFN Polyethersulfone (PES) 0.020" (0.50mm) Gold - 64 (4 x 16) Beryllium Copper
200-6311-9UN-1900
RFQ
VIEW
RFQ
3,967
In-stock
3M CONN SOCKET PGA ZIF 121POS GOLD Textool™ Active Bulk -55°C ~ 150°C Through Hole Solder - PGA, ZIF (ZIP) Polyethersulfone (PES) 0.100" (2.54mm) Gold 30.0µin (0.76µm) 121 (11 x 11) Beryllium Copper