Applied Filters :
2 results
Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post
GLOBAL STOCKS
44-547-11
RFQ
VIEW
RFQ
2,674
In-stock
Aries Electronics CONN SOCKET SOIC ZIF 44POS GOLD 547 Active Bulk Through Hole Solder Closed Frame SOIC, ZIF (ZIP) Polyphenylene Sulfide (PPS), Glass Filled - Gold 20.0µin (0.51µm) 44 (2 x 22) Beryllium Copper 0.050" (1.27mm)
44-547-11E
RFQ
VIEW
RFQ
3,410
In-stock
Aries Electronics CONN SOCKET SOIC ZIF 44POS GOLD 547 Active Bulk Through Hole Solder Closed Frame SOIC, ZIF (ZIP) Polyphenylene Sulfide (PPS), Glass Filled - Gold 20.0µin (0.51µm) 44 (2 x 22) Beryllium Copper 0.050" (1.27mm)