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Picture Mfr Part # QUANTITY Inventory MANUFACTURE Description Package Series Part Status Packaging Operating Temperature Mounting Type Termination Features Type Housing Material Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Number of Positions or Pins (Grid) Contact Material - Mating
GLOBAL STOCKS
DILB32P-223TLF
RFQ
VIEW
RFQ
3,070
In-stock
Amphenol FCI CONN IC DIP SOCKET 32POS TINLEAD DILB Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 32 (2 x 16) Copper Alloy
DILB18P-223TLF
RFQ
VIEW
RFQ
1,287
In-stock
Amphenol FCI CONN IC DIP SOCKET 18POS TINLEAD DILB Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 18 (2 x 9) Copper Alloy
Default Photo
RFQ
VIEW
RFQ
1,216
In-stock
Amphenol FCI CONN IC DIP SOCKET 42POS TINLEAD DILB Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 42 (2 x 21) Copper Alloy
Default Photo
RFQ
VIEW
RFQ
1,024
In-stock
Amphenol FCI CONN IC DIP SOCKET 24POS TINLEAD DILB Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.3" (7.62mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 24 (2 x 12) Copper Alloy
Default Photo
RFQ
VIEW
RFQ
3,083
In-stock
Amphenol FCI CONN IC DIP SOCKET 24POS TINLEAD DILB Active Tube -55°C ~ 125°C Through Hole Solder Open Frame DIP, 0.6" (15.24mm) Row Spacing Polyamide (PA), Nylon 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) 24 (2 x 12) Copper Alloy