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46 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Height Above Board | Material Flammability Rating | Number of Positions | Contact Finish | Pitch | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | Connector/Contact Type | FFC, FCB Thickness | Locking Feature | Cable End Type | Actuator Material | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||||||||
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VIEW |
1,378
In-stock
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JAE Electronics | CONN FPC BOTTOM 15POS 0.50MM R/A | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.057" (1.45mm) | UL94 V-0 | 15 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
1,868
In-stock
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JAE Electronics | CONN FPC BOTTOM 24POS 0.50MM R/A | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.057" (1.45mm) | UL94 V-0 | 24 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
3,356
In-stock
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JAE Electronics | CONN FPC BOTTOM 8POS 0.50MM R/A | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.057" (1.45mm) | UL94 V-0 | 8 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
1,446
In-stock
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JAE Electronics | CONN FPC BOTTOM 40POS 0.50MM R/A | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.057" (1.45mm) | UL94 V-0 | 40 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
1,216
In-stock
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JAE Electronics | CONN FPC BOTTOM 26POS 0.50MM R/A | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.057" (1.45mm) | UL94 V-0 | 26 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
2,392
In-stock
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JAE Electronics | CONN FPC BOTTOM 36POS 0.50MM R/A | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.057" (1.45mm) | UL94 V-0 | 36 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
2,390
In-stock
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JAE Electronics | CONN FPC BOTTOM 50POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 50 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
1,535
In-stock
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JAE Electronics | CONN FPC BOTTOM 20POS 0.50MM R/A | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.057" (1.45mm) | UL94 V-0 | 20 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
2,773
In-stock
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JAE Electronics | CONN FPC BOTTOM 16POS 0.50MM R/A | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.057" (1.45mm) | UL94 V-0 | 16 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
2,066
In-stock
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JAE Electronics | CONN FPC BOTTOM 18POS 0.50MM R/A | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.057" (1.45mm) | UL94 V-0 | 18 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
1,630
In-stock
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JAE Electronics | CONN FPC BOTTOM 6POS 0.50MM R/A | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.057" (1.45mm) | UL94 V-0 | 6 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
1,308
In-stock
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JAE Electronics | CONN FPC BOTTOM 40POS 0.50MM SMD | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 40 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
2,572
In-stock
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JAE Electronics | CONN FPC BOTTOM 10POS 0.50MM R/A | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.057" (1.45mm) | UL94 V-0 | 10 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
2,722
In-stock
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JAE Electronics | CONN FPC BOTTOM 50POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 50 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
2,633
In-stock
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JAE Electronics | CONN FPC BOTTOM 45POS 0.50MM R/A | FA5 | Active | Tray | -40°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.057" (1.45mm) | UL94 V-0 | 45 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
3,487
In-stock
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JAE Electronics | CONN FPC BOTTOM 24POS 0.50MM R/A | FA5 | Active | Tray | -40°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.057" (1.45mm) | UL94 V-0 | 24 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
2,058
In-stock
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JAE Electronics | CONN FPC BOTTOM 36POS 0.50MM R/A | FA5 | Active | Tray | -40°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.057" (1.45mm) | UL94 V-0 | 36 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
2,841
In-stock
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JAE Electronics | CONN FPC BOTTOM 45POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 45 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
2,867
In-stock
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JAE Electronics | CONN FPC BOTTOM 30POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 30 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
1,937
In-stock
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JAE Electronics | CONN FPC BOTTOM 30POS 0.50MM R/A | FA5 | Active | Tray | -40°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.057" (1.45mm) | UL94 V-0 | 30 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
1,251
In-stock
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JAE Electronics | CONN FPC BOTTOM 50POS 0.50MM SMD | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 50 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
3,706
In-stock
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JAE Electronics | CONN FPC BOTTOM 30POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 30 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
745
In-stock
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JAE Electronics | CONN FPC BOTTOM 20POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 20 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
1,518
In-stock
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JAE Electronics | CONN FPC BOTTOM 26POS 0.50MM R/A | FA5 | Active | Tray | -40°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.057" (1.45mm) | UL94 V-0 | 26 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
3,780
In-stock
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JAE Electronics | CONN FPC BOTTOM 36POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 36 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
3,103
In-stock
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JAE Electronics | CONN FPC BOTTOM 8POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 8 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
2,506
In-stock
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JAE Electronics | CONN FPC BOTTOM 20POS 0.50MM R/A | FA5 | Active | Tray | -40°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.057" (1.45mm) | UL94 V-0 | 20 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
1,485
In-stock
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JAE Electronics | CONN FPC BOTTOM 22POS 0.50MM R/A | FA5 | Active | Tray | -40°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.057" (1.45mm) | UL94 V-0 | 22 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
819
In-stock
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JAE Electronics | CONN FPC BOTTOM 16POS 0.50MM R/A | FA5 | Active | Tray | -40°C ~ 85°C | Surface Mount, Right Angle | Solder | Solder Retention, Zero ion Force (ZIF) | 0.057" (1.45mm) | UL94 V-0 | 16 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
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VIEW |
1,437
In-stock
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JAE Electronics | CONN FPC BOTTOM 16POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 16 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | |||
