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6 results
| Picture | Mfr Part # | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Voltage Range | Current - Supply | Port Location | Termination | Size / Dimension | Type | Output Type | Direction | Frequency Range | Sensitivity | S/N Ratio | Height (Max) | Shape | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||
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VIEW |
1,490
In-stock
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TDK InvenSense | MIC MEMS DIGITAL OMNI -26DB | - | Active | Digi-Reel® | 1.62V ~ 3.63V | 1.5mA | Bottom | Solder Pads | 0.157" L x 0.118" W (4.00mm x 3.00mm) | MEMS (Silicon) | Digital, TDM | Omnidirectional | 50Hz ~ 20kHz | -26 ±1dB @ 94dB SPL | 65dB | 0.043" (1.10mm) | Rectangular | |||
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VIEW |
1,327
In-stock
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TDK InvenSense | MIC MEMS DIGITAL OMNI -26DB | - | Active | Cut Tape (CT) | 1.62V ~ 3.63V | 1.5mA | Bottom | Solder Pads | 0.157" L x 0.118" W (4.00mm x 3.00mm) | MEMS (Silicon) | Digital, TDM | Omnidirectional | 50Hz ~ 20kHz | -26 ±1dB @ 94dB SPL | 65dB | 0.043" (1.10mm) | Rectangular | |||
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|
VIEW |
2,331
In-stock
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TDK InvenSense | MIC MEMS DIGITAL OMNI -26DB | - | Active | Tape & Reel (TR) | 1.62V ~ 3.63V | 1.5mA | Bottom | Solder Pads | 0.157" L x 0.118" W (4.00mm x 3.00mm) | MEMS (Silicon) | Digital, TDM | Omnidirectional | 50Hz ~ 20kHz | -26 ±1dB @ 94dB SPL | 65dB | 0.043" (1.10mm) | Rectangular | |||
|
VIEW |
2,484
In-stock
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TDK InvenSense | MIC MEMS DIGITAL I2S OMNI -26DB | - | Active | Digi-Reel® | 1.62V ~ 3.63V | 1.5mA | Bottom | Solder Pads | 0.157" L x 0.118" W (4.00mm x 3.00mm) | MEMS (Silicon) | Digital, I²S | Omnidirectional | 50Hz ~ 20kHz | -26dB ±1dB @ 94dB SPL | 65dB | 0.043" (1.10mm) | Rectangular | |||
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|
VIEW |
727
In-stock
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TDK InvenSense | MIC MEMS DIGITAL I2S OMNI -26DB | - | Active | Cut Tape (CT) | 1.62V ~ 3.63V | 1.5mA | Bottom | Solder Pads | 0.157" L x 0.118" W (4.00mm x 3.00mm) | MEMS (Silicon) | Digital, I²S | Omnidirectional | 50Hz ~ 20kHz | -26dB ±1dB @ 94dB SPL | 65dB | 0.043" (1.10mm) | Rectangular | |||
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|
VIEW |
3,585
In-stock
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TDK InvenSense | MIC MEMS DIGITAL I2S OMNI -26DB | - | Active | Tape & Reel (TR) | 1.62V ~ 3.63V | 1.5mA | Bottom | Solder Pads | 0.157" L x 0.118" W (4.00mm x 3.00mm) | MEMS (Silicon) | Digital, I²S | Omnidirectional | 50Hz ~ 20kHz | -26dB ±1dB @ 94dB SPL | 65dB | 0.043" (1.10mm) | Rectangular | |||
